Challenges in Three-Dimensional Printing of High-Conductivity Copper

With recent advancements in additive manufacturing (AM) technology, it is possible to deposit copper conductive paths and insulation layers of an electric machine in a selective controlled manner. AM of copper enables higher fill factors that improves the internal thermal conduction in the stator co...

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Veröffentlicht in:	Journal of electronic packaging 2018-06, Vol.140 (2)
Hauptverfasser:	El-Wardany, Tahany I, She, Ying, Jagdale, Vijay N, Garofano, Jacquelynn K, Liou, Joe J, Schmidt, Wayde R
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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