A New Analytical Method for Calculating Maximum Junction Temperature of Packaged Devices Incorporating the Temperature Distribution at the Base of the Substrate

All current analytical methods for calculating junction temperature of field effect transistor (FET) and monolithic microwave integrated circuits (MMIC) devices have assumed a constant uniform temperature at the base of the substrate. In a packaged device, however, where the substrate is attached to...

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Veröffentlicht in:	Journal of electronic packaging 2015-03, Vol.137 (1)
Hauptverfasser:	Ling, J. H. L, Tay, A. A. O
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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