Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test

In this study, a lead-free dummy plastic ball grid array component with daisy-chains and Sn4.0Ag0.5Cu Pb-free solder balls was assembled on an halogen-free high density interconnection printed circuit board (PCB) by using Sn1.0Ag0.5Cu solder paste on the Cu pad surfaces of either organic solderable...

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Veröffentlicht in:	Journal of electronic packaging 2012-03, Vol.134 (1)
Hauptverfasser:	Chang, Hung-Jen, Zhan, Chau-Jie, Chang, Tao-Chih, Chou, Jung-Hua
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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