An Experimental and Computational Study on Moisture Induced Epoxy Swelling in Non-hermetic Optoelectronic Packages
Moisture induced epoxy swelling is a potential failure mechanism in nonhermetic packages. Epoxy materials used in the package absorb moisture and swell in a relatively humid environment. This will result in hygroscopic stresses in the material that can eventually lead to failure. The coefficient of...
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| Veröffentlicht in: | Journal of electronic packaging 2012-03, Vol.134 (1) |
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| Hauptverfasser: | , , |
| Format: | Artikel |
| Sprache: | eng |
| Online-Zugang: | Volltext |
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