Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique

The next generation of thermal interface materials (TIMs) are currently being developed to meet the increasing demands of high-powered semiconductor devices. In particular, a variety of nanostructured materials, such as carbon nanotubes (CNTs), are interesting due to their ability to provide low res...

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Veröffentlicht in:	Journal of electronic packaging 2012-06, Vol.134 (2)
Hauptverfasser:	Wasniewski, Joseph R, Altman, David H, Hodson, Stephen L, Fisher, Timothy S, Bulusu, Anuradha, Graham, Samuel, Cola, Baratunde A
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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