Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages

Today’s consumer market demands electronics that are smaller, faster, and cheaper. To cater to these demands, novel materials, new designs, and new packaging technologies are introduced frequently. Wafer level chip scale package (WLCSP) is one of the emerging package technologies that have the key a...

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Veröffentlicht in:	Journal of electronic packaging 2012-06, Vol.134 (2)
Hauptverfasser:	Tumne, P, Venkatadri, V, Kudtarkar, S, Delaus, M, Santos, D, Havens, R, Srihari, K
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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