A Review of Recent Advances in Thermal Management in Three Dimensional Chip Stacks in Electronic Systems

Three dimensional (3D) integration offers numerous electrical advantages like shorter interconnection distances between different dies in the stack, reduced signal delay, reduced interconnect power and design flexibilities. The main enabler of 3D integration is through-silicon-vias (TSVs) and stacki...

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Veröffentlicht in:	Journal of electronic packaging 2011-12, Vol.133 (4)
Hauptverfasser:	Venkatadri, Vikram, Sammakia, Bahgat, Srihari, Krishnaswami, Santos, Daryl
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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