Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board

In this study, time-temperature-dependent nonlinear analyses of lead-free solder bumped wafer level chip scale package (WLCSP) on printed circuit board (PCB) assemblies subjected to thermal cycling conditions are presented. Two different lead-free solder alloys are considered, namely, 96.5wt percent...

Ausführliche Beschreibung

Bibliographische Detailangaben

Veröffentlicht in:	Journal of electronic packaging 2002-06, Vol.124 (2), p.69-76
Hauptverfasser:	Lau, John H, Pan, Stephen H, Chang, Chris
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!