Review of Models and the Disturbed State Concept for Thermomechanical Analysis in Electronic Packaging
A number of models for thermomechanical stress analysis and fatigue failure of materials are reviewed and their capabilities and limitations are identified. The unified disturbed state concept (DSC) for constitutive modeling of materials and interfaces is presented and compared with other approaches...
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| Veröffentlicht in: | Journal of electronic packaging 2001-03, Vol.123 (1), p.19-33 |
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| Hauptverfasser: | , |
| Format: | Artikel |
| Sprache: | eng |
| Online-Zugang: | Volltext |
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