Guest Editorial Special Section on the 2022 SEMI Advanced Semiconductor Manufacturing Conference

Guest Editorial Special Section on the 2022 SEMI Advanced Semiconductor Manufacturing Conference

The 2022 ASMC, our 33rd, returned to Saratoga Springs, NY as an in-person conference after 2 years as a virtual conference. While we are all grateful for the digital world's enhancements that allowed this conference to be held remotely, attendees were happy to return to an in-person event where...

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Veröffentlicht in:IEEE transactions on semiconductor manufacturing 2023-08, Vol.36 (3), p.307-310
Hauptverfasser: Bickford, Jeanne Paulette, Patterson, Oliver D., Le Cunff, Delphine, Buengener, Ralf, Radloff, Stefan, Werbaneth, Paul
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Sprache:eng
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Meetings
Semiconductor device manufacture
Special issues and sections
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container_end_page 310
container_issue 3
container_start_page 307
container_title IEEE transactions on semiconductor manufacturing
container_volume 36
creator Bickford, Jeanne Paulette
Patterson, Oliver D.
Le Cunff, Delphine
Buengener, Ralf
Radloff, Stefan
Werbaneth, Paul
description The 2022 ASMC, our 33rd, returned to Saratoga Springs, NY as an in-person conference after 2 years as a virtual conference. While we are all grateful for the digital world's enhancements that allowed this conference to be held remotely, attendees were happy to return to an in-person event where networking is much easier.
doi_str_mv 10.1109/TSM.2023.3297059
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subjects Meetings
Semiconductor device manufacture
Special issues and sections
title Guest Editorial Special Section on the 2022 SEMI Advanced Semiconductor Manufacturing Conference
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