Wafer Surface Charging Model for Single-Wafer Wet-Spin Processes

Wet chemical processes in integrated circuit (IC) manufacturing are used in many applications, e.g., post-etch residue removal and pre-deposition surface treatment. While advanced single-wafer wet spin tools are part of the critical tool-set for advanced IC fabrication, non-optimized tool hardware a...

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Veröffentlicht in:	IEEE transactions on semiconductor manufacturing 2011-11, Vol.24 (4), p.552-558
Hauptverfasser:	Mui, D. S. L., Lenz, E. H., Cyterski, C., Venkataraman, K., Kawaguchi, M.
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Charge advection Charge distribution Charging Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology flow electrification Hydrodynamics Integrated circuits Liquids Mathematical models Microelectronic fabrication (materials and surfaces technology) semiconductor Semiconductor device modeling Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Semiconductors Shear flow Silicon single-wafer Space charge spin Surface charging Surface treatment Wafers wet clean
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