The Use of Ceramic Matrices Infiltrated with Silver for Electric Contact Applications

Results are presented of experiments that compare the performance of three ceramic-Ag contact materials (TiC-Ag, TiB 2 -Ag and NbC-Ag) with the well known WAg contact material. The conductivities of the ceramic-Ag contacts were found to be comparable to that of W-Ag. Erosion measurements in an 880 A...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	IEEE transactions on parts, hybrids, and packaging hybrids, and packaging, 1974-03, Vol.10 (1), p.37-42
Hauptverfasser:	Slade, P., Kossowsky, R., Aspden, R., Bratton, R.
Format:	Artikel
Sprache:	eng
Schlagworte:	Ceramics Circuit breakers Circuit testing Conducting materials Conductivity Low voltage Materials testing Performance evaluation Silver Surface tension
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page	42
container_issue	1
container_start_page	37
container_title	IEEE transactions on parts, hybrids, and packaging
container_volume	10
creator	Slade, P. Kossowsky, R. Aspden, R. Bratton, R.
description	Results are presented of experiments that compare the performance of three ceramic-Ag contact materials (TiC-Ag, TiB 2 -Ag and NbC-Ag) with the well known WAg contact material. The conductivities of the ceramic-Ag contacts were found to be comparable to that of W-Ag. Erosion measurements in an 880 A 440 V rms circuit showed that the rate of erosion was not a simple function of the ceramic material's heat of evaporation. The erosion mainly occurred through evaporation with some particle ejection in case of the W-Ag and NbC-Ag materials. The ceramic-Ag materials performed well when subjected to testing in a 100 A low voltage circuit breaker. A microstructural evaluation revealed that the contacts could have been improved by lowering the surface tension between the ceramic and silver to achieve better wet- ting.
doi_str_mv	10.1109/TPHP.1974.1134833
format	Article
fullrecord	<record><control><sourceid>crossref_RIE</sourceid><recordid>TN_cdi_crossref_primary_10_1109_TPHP_1974_1134833</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>1134833</ieee_id><sourcerecordid>10_1109_TPHP_1974_1134833</sourcerecordid><originalsourceid>FETCH-LOGICAL-c263t-d0b64855ed76d50cc5bd32dbef4703e14262c1bb94d375392b3c9565cb5afee53</originalsourceid><addsrcrecordid>eNpFkMtKAzEYhYMoWKsPIG7yAlNzn8myDNUWKhZs10Muf2hk2ilJUHx7HVpwdTicy-JD6JGSGaVEP283y82M6lr8WS4azq_QhErZVEwofY0mhCtaUULILbrL-ZMQJhqtJ2i33QPeZcBDwC0kc4gOv5mSooOMV8cQ-5JMAY-_Y9njj9h_QcJhSHjRgxtruB2OxbiC56dTH50pcTjme3QTTJ_h4aJTtHtZbNtltX5_XbXzdeWY4qXyxCrRSAm-Vl4S56T1nHkLQdSEAxVMMUet1cLzWnLNLHdaKumsNAFA8imi51-XhpwThO6U4sGkn46SbuTSjVy6kUt34fK3eTpvIgD89y_pLwfJX5I</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>The Use of Ceramic Matrices Infiltrated with Silver for Electric Contact Applications</title><source>IEEE Electronic Library (IEL)</source><creator>Slade, P. ; Kossowsky, R. ; Aspden, R. ; Bratton, R.</creator><creatorcontrib>Slade, P. ; Kossowsky, R. ; Aspden, R. ; Bratton, R.</creatorcontrib><description>Results are presented of experiments that compare the performance of three ceramic-Ag contact materials (TiC-Ag, TiB 2 -Ag and NbC-Ag) with the well known WAg contact material. The conductivities of the ceramic-Ag contacts were found to be comparable to that of W-Ag. Erosion measurements in an 880 A 440 V rms circuit showed that the rate of erosion was not a simple function of the ceramic material's heat of evaporation. The erosion mainly occurred through evaporation with some particle ejection in case of the W-Ag and NbC-Ag materials. The ceramic-Ag materials performed well when subjected to testing in a 100 A low voltage circuit breaker. A microstructural evaluation revealed that the contacts could have been improved by lowering the surface tension between the ceramic and silver to achieve better wet- ting.</description><identifier>ISSN: 0361-1000</identifier><identifier>EISSN: 1558-2469</identifier><identifier>DOI: 10.1109/TPHP.1974.1134833</identifier><language>eng</language><publisher>IEEE</publisher><subject>Ceramics ; Circuit breakers ; Circuit testing ; Conducting materials ; Conductivity ; Low voltage ; Materials testing ; Performance evaluation ; Silver ; Surface tension</subject><ispartof>IEEE transactions on parts, hybrids, and packaging, 1974-03, Vol.10 (1), p.37-42</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c263t-d0b64855ed76d50cc5bd32dbef4703e14262c1bb94d375392b3c9565cb5afee53</citedby><cites>FETCH-LOGICAL-c263t-d0b64855ed76d50cc5bd32dbef4703e14262c1bb94d375392b3c9565cb5afee53</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/1134833$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,776,780,792,27903,27904,54736</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/1134833$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Slade, P.</creatorcontrib><creatorcontrib>Kossowsky, R.</creatorcontrib><creatorcontrib>Aspden, R.</creatorcontrib><creatorcontrib>Bratton, R.</creatorcontrib><title>The Use of Ceramic Matrices Infiltrated with Silver for Electric Contact Applications</title><title>IEEE transactions on parts, hybrids, and packaging</title><addtitle>T-CPT</addtitle><description>Results are presented of experiments that compare the performance of three ceramic-Ag contact materials (TiC-Ag, TiB 2 -Ag and NbC-Ag) with the well known WAg contact material. The conductivities of the ceramic-Ag contacts were found to be comparable to that of W-Ag. Erosion measurements in an 880 A 440 V rms circuit showed that the rate of erosion was not a simple function of the ceramic material's heat of evaporation. The erosion mainly occurred through evaporation with some particle ejection in case of the W-Ag and NbC-Ag materials. The ceramic-Ag materials performed well when subjected to testing in a 100 A low voltage circuit breaker. A microstructural evaluation revealed that the contacts could have been improved by lowering the surface tension between the ceramic and silver to achieve better wet- ting.</description><subject>Ceramics</subject><subject>Circuit breakers</subject><subject>Circuit testing</subject><subject>Conducting materials</subject><subject>Conductivity</subject><subject>Low voltage</subject><subject>Materials testing</subject><subject>Performance evaluation</subject><subject>Silver</subject><subject>Surface tension</subject><issn>0361-1000</issn><issn>1558-2469</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1974</creationdate><recordtype>article</recordtype><recordid>eNpFkMtKAzEYhYMoWKsPIG7yAlNzn8myDNUWKhZs10Muf2hk2ilJUHx7HVpwdTicy-JD6JGSGaVEP283y82M6lr8WS4azq_QhErZVEwofY0mhCtaUULILbrL-ZMQJhqtJ2i33QPeZcBDwC0kc4gOv5mSooOMV8cQ-5JMAY-_Y9njj9h_QcJhSHjRgxtruB2OxbiC56dTH50pcTjme3QTTJ_h4aJTtHtZbNtltX5_XbXzdeWY4qXyxCrRSAm-Vl4S56T1nHkLQdSEAxVMMUet1cLzWnLNLHdaKumsNAFA8imi51-XhpwThO6U4sGkn46SbuTSjVy6kUt34fK3eTpvIgD89y_pLwfJX5I</recordid><startdate>197403</startdate><enddate>197403</enddate><creator>Slade, P.</creator><creator>Kossowsky, R.</creator><creator>Aspden, R.</creator><creator>Bratton, R.</creator><general>IEEE</general><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>197403</creationdate><title>The Use of Ceramic Matrices Infiltrated with Silver for Electric Contact Applications</title><author>Slade, P. ; Kossowsky, R. ; Aspden, R. ; Bratton, R.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c263t-d0b64855ed76d50cc5bd32dbef4703e14262c1bb94d375392b3c9565cb5afee53</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>1974</creationdate><topic>Ceramics</topic><topic>Circuit breakers</topic><topic>Circuit testing</topic><topic>Conducting materials</topic><topic>Conductivity</topic><topic>Low voltage</topic><topic>Materials testing</topic><topic>Performance evaluation</topic><topic>Silver</topic><topic>Surface tension</topic><toplevel>online_resources</toplevel><creatorcontrib>Slade, P.</creatorcontrib><creatorcontrib>Kossowsky, R.</creatorcontrib><creatorcontrib>Aspden, R.</creatorcontrib><creatorcontrib>Bratton, R.</creatorcontrib><collection>CrossRef</collection><jtitle>IEEE transactions on parts, hybrids, and packaging</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Slade, P.</au><au>Kossowsky, R.</au><au>Aspden, R.</au><au>Bratton, R.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>The Use of Ceramic Matrices Infiltrated with Silver for Electric Contact Applications</atitle><jtitle>IEEE transactions on parts, hybrids, and packaging</jtitle><stitle>T-CPT</stitle><date>1974-03</date><risdate>1974</risdate><volume>10</volume><issue>1</issue><spage>37</spage><epage>42</epage><pages>37-42</pages><issn>0361-1000</issn><eissn>1558-2469</eissn><abstract>Results are presented of experiments that compare the performance of three ceramic-Ag contact materials (TiC-Ag, TiB 2 -Ag and NbC-Ag) with the well known WAg contact material. The conductivities of the ceramic-Ag contacts were found to be comparable to that of W-Ag. Erosion measurements in an 880 A 440 V rms circuit showed that the rate of erosion was not a simple function of the ceramic material's heat of evaporation. The erosion mainly occurred through evaporation with some particle ejection in case of the W-Ag and NbC-Ag materials. The ceramic-Ag materials performed well when subjected to testing in a 100 A low voltage circuit breaker. A microstructural evaluation revealed that the contacts could have been improved by lowering the surface tension between the ceramic and silver to achieve better wet- ting.</abstract><pub>IEEE</pub><doi>10.1109/TPHP.1974.1134833</doi><tpages>6</tpages></addata></record>
fulltext	fulltext_linktorsrc
identifier	ISSN: 0361-1000
ispartof	IEEE transactions on parts, hybrids, and packaging, 1974-03, Vol.10 (1), p.37-42
issn	0361-1000 1558-2469
language	eng
recordid	cdi_crossref_primary_10_1109_TPHP_1974_1134833
source	IEEE Electronic Library (IEL)
subjects	Ceramics Circuit breakers Circuit testing Conducting materials Conductivity Low voltage Materials testing Performance evaluation Silver Surface tension
title	The Use of Ceramic Matrices Infiltrated with Silver for Electric Contact Applications
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-26T11%3A31%3A22IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-crossref_RIE&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=The%20Use%20of%20Ceramic%20Matrices%20Infiltrated%20with%20Silver%20for%20Electric%20Contact%20Applications&rft.jtitle=IEEE%20transactions%20on%20parts,%20hybrids,%20and%20packaging&rft.au=Slade,%20P.&rft.date=1974-03&rft.volume=10&rft.issue=1&rft.spage=37&rft.epage=42&rft.pages=37-42&rft.issn=0361-1000&rft.eissn=1558-2469&rft_id=info:doi/10.1109/TPHP.1974.1134833&rft_dat=%3Ccrossref_RIE%3E10_1109_TPHP_1974_1134833%3C/crossref_RIE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=1134833&rfr_iscdi=true