A Cu-Plate-Bonded System-in-Package (SiP) With Low Spreading Resistance of Topside Electrodes for Voltage Regulators

This paper presents a system-in-package (SiP) with Cu-plate bonding for voltage regulators. The SiP reduces the power loss by 23% and the thermal resistance by 44% compared to those of a SiP with wire bonding. Copper plates reduce the spreading resistance of the topside electrodes in the MOSFETs, le...

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Veröffentlicht in:	IEEE transactions on power electronics 2010-09, Vol.25 (9), p.2310-2319
Hauptverfasser:	Hashimoto, Takayuki, Uno, Tomoaki, Shiraishi, Masaki, Kawashima, Tetsuya, Akiyama, Noboru, Matsuura, Nobuyoshi, Akagi, Hirofumi
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Bonding BONDS Capacitive sensors Circuit properties Copper DC > DC power conversion Design. Technologies. Operation analysis. Testing Electric currents Electric, optical and optoelectronic circuits Electrical equipment ELECTRODES Electronic circuits Electronics Exact sciences and technology HEAT TRANSFER Integrated circuits Lead MOSFETs Other multijunction devices. Power transistors. Thyristors PACKAGING PLATE Plates Power loss power MOSFETs Regulators Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Semiconductors Signal convertors SOLDERING ALLOYS Solders Spreading Temperature Thermal resistance Transistors VOLTAGE Wire
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