RC-Based Temperature Prediction Scheme for Proactive Dynamic Thermal Management in Throttle-Based 3D NoCs

The three-dimensional Network-on-Chip (3D NoC) has been proposed to solve the complex on-chip communication issues in multicore systems using die stacking in recent days. Because of the larger power density and the heterogeneous thermal conductance in different silicon layers of 3D NoC, the thermal...

Ausführliche Beschreibung

Bibliographische Detailangaben

Veröffentlicht in:	IEEE transactions on parallel and distributed systems 2015-01, Vol.26 (1), p.206-218
Hauptverfasser:	Chen, Kun-Chih, Chang, En-Jui, Li, Huai-Ting, Wu, An-Yeu
Format:	Artikel
Sprache:	eng
Schlagworte:	Constants Dynamical systems Dynamics Mathematical models Predictive models Temperature control Temperature measurement Temperature sensors Thermal conductivity Thermal management Three dimensional Three-dimensional displays
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!