A fully integrated broad-band amplifier MMIC employing a novel chip-size package

In this work, we used a novel RF chip-size package (CSP) to develop a broad-band amplifier monolithic microwave integrated circuit (MMIC), including all the matching and biasing components, for Ku- and K-band applications. By utilizing an anisotropic conductive film for the RF-CSP, the fabrication p...

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Veröffentlicht in:	IEEE transactions on microwave theory and techniques 2002-12, Vol.50 (12), p.2930-2937
Hauptverfasser:	Yun, Young, Nishijima, Masaaki, Katsuno, Motonari, Ishida, Hidetoshi, Minagawa, Katsuya, Nobusada, Toshihide, Tanaka, Tsuyoshi
Format:	Artikel
Sprache:	eng
Schlagworte:	Amplifiers Anisotropy Application specific integrated circuits Chip scale packaging Circuit stability Direct current Frequency ranges Integrated circuit packaging K-band Microwave amplifiers Microwave integrated circuits Microwaves MMICs Packages Radio frequencies Radio frequency Radiofrequency amplifiers Stability
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