Submodule Temperature Regulation and Balancing in Modular Multilevel Converters
In modular multilevel converters (MMCs), temperature control of semiconductor devices in the submodules (SMs) is a key factor for the safe and reliable operation. Under normal operation, significant temperature differences can exist between SMs due to, for example, aging of semiconductor modules and...
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| Veröffentlicht in: | IEEE transactions on industrial electronics (1982) 2018-09, Vol.65 (9), p.7085-7094 |
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| container_title | IEEE transactions on industrial electronics (1982) |
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| creator | Goncalves, Jorge Rogers, Daniel J. Jun Liang |
| description | In modular multilevel converters (MMCs), temperature control of semiconductor devices in the submodules (SMs) is a key factor for the safe and reliable operation. Under normal operation, significant temperature differences can exist between SMs due to, for example, aging of semiconductor modules and module parameter mismatch. This paper presents a method for achieving SM thermal balancing by controlling the capacitor voltage of each SM in an arm, while maintaining the sum of the SM capacitor voltages at a constant value in order to regulate the dc-link voltage. The proposed temperature balancing strategy is validated using an experimental MMC setup with three SMs, where an increase in the thermal resistance to ambient of one or more SM semiconductors is created by restricting coolant flow to simulate a partial failure in the cooling system. Increases in the thermal resistance by 21% and 42%, corresponding to temperature increases of 5 and 10 ^{\circ}C, respectively, are managed by three SMs, using a capacitor voltage margin of 60%. |
| doi_str_mv | 10.1109/TIE.2018.2795588 |
| format | Article |
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Under normal operation, significant temperature differences can exist between SMs due to, for example, aging of semiconductor modules and module parameter mismatch. This paper presents a method for achieving SM thermal balancing by controlling the capacitor voltage of each SM in an arm, while maintaining the sum of the SM capacitor voltages at a constant value in order to regulate the dc-link voltage. The proposed temperature balancing strategy is validated using an experimental MMC setup with three SMs, where an increase in the thermal resistance to ambient of one or more SM semiconductors is created by restricting coolant flow to simulate a partial failure in the cooling system. 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Increases in the thermal resistance by 21% and 42%, corresponding to temperature increases of 5 and 10 ^{\circ}C, respectively, are managed by three SMs, using a capacitor voltage margin of 60%.</description><subject>Capacitor voltage balancing</subject><subject>Capacitors</subject><subject>Converters</subject><subject>Cooling systems</subject><subject>Electric potential</subject><subject>electronics cooling</subject><subject>Heat transfer</subject><subject>Insulated gate bipolar transistors</subject><subject>Metal matrix composites</subject><subject>Modular equipment</subject><subject>modular multilevel converter (MMC)</subject><subject>power semiconductor devices</subject><subject>Semiconductor devices</subject><subject>Semiconductor diodes</subject><subject>Temperature control</subject><subject>Temperature gradients</subject><subject>Temperature measurement</subject><subject>thermal management of electronics</subject><subject>Thermal resistance</subject><subject>Voltage control</subject><issn>0278-0046</issn><issn>1557-9948</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2018</creationdate><recordtype>article</recordtype><sourceid>ESBDL</sourceid><sourceid>RIE</sourceid><recordid>eNo9kEtLAzEUhYMoWKt7wU3A9dSbV5MstfgotBS0rkNm5k6Zks7UZKbgv3dKi6uz-c69h4-QewYTxsA-reevEw7MTLi2ShlzQUZMKZ1ZK80lGQHXJgOQ02tyk9IWgEnF1Iisvvp815Z9QLrG3R6j7_qI9BM3ffBd3TbUNyV98cE3Rd1saN3Q5RH3kS770NUBDxjorG0OGDuM6ZZcVT4kvDvnmHy_va5nH9li9T6fPS-yQgjRZZUGqZX2QsnSVhx1IQGH1dx7hszwgmvOAUptK1sa5aWvci2nzMg8V0x6MSaPp7v72P70mDq3bfvYDC8dByGl1FazgYITVcQ2pYiV28d65-OvY-CO2tygzR21ubO2ofJwqtSI-I8brqdKG_EHFpholA</recordid><startdate>20180901</startdate><enddate>20180901</enddate><creator>Goncalves, Jorge</creator><creator>Rogers, Daniel J.</creator><creator>Jun Liang</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. 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| fulltext | fulltext |
| identifier | ISSN: 0278-0046 |
| ispartof | IEEE transactions on industrial electronics (1982), 2018-09, Vol.65 (9), p.7085-7094 |
| issn | 0278-0046 1557-9948 |
| language | eng |
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| source | IEEE/IET Electronic Library (IEL) |
| subjects | Capacitor voltage balancing Capacitors Converters Cooling systems Electric potential electronics cooling Heat transfer Insulated gate bipolar transistors Metal matrix composites Modular equipment modular multilevel converter (MMC) power semiconductor devices Semiconductor devices Semiconductor diodes Temperature control Temperature gradients Temperature measurement thermal management of electronics Thermal resistance Voltage control |
| title | Submodule Temperature Regulation and Balancing in Modular Multilevel Converters |
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