Thick-film hybrid technology for low-output-voltage DC/DC converter
The new requirements in portable and telecommunication equipment also affect the supply systems. The current tendency to lower the output voltage (3.3, 2.7 V/sub DC/) together with the necessity of an important size reduction is modifying the strategies for dc/dc converter implementation. Low-voltag...
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Veröffentlicht in: | IEEE transactions on industry applications 2004-01, Vol.40 (1), p.86-93 |
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creator | Pernia, A.M. Prieto, M.J. Lopera, J.M. Reilly, J. Linton, S.S. Quinones, C. |
description | The new requirements in portable and telecommunication equipment also affect the supply systems. The current tendency to lower the output voltage (3.3, 2.7 V/sub DC/) together with the necessity of an important size reduction is modifying the strategies for dc/dc converter implementation. Low-voltage high-power-density applications present two important factors that must be analyzed: thermal problems due to high power density, and the high currents to be handled. This paper presents a 10-W dc/dc buck converter with passive integration using hybrid technology (within the frame of ESPRIT Project 23910.). As a result of the mentioned integration technique, a power density of 6.25 W/cm/sup 3/ was obtained with high efficiency (approximately 90%). |
doi_str_mv | 10.1109/TIA.2003.821814 |
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fullrecord | <record><control><sourceid>proquest_RIE</sourceid><recordid>TN_cdi_crossref_primary_10_1109_TIA_2003_821814</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>1268183</ieee_id><sourcerecordid>29667630</sourcerecordid><originalsourceid>FETCH-LOGICAL-c348t-234b2e337264748a5794533d704281505903cc9a2da43bc93ea086eed8bce0c43</originalsourceid><addsrcrecordid>eNqFkD1PwzAURS0EEqUwM7BEDGxpn_0cxx6r8FWpEkuZrdR5aVPSujhJUf89qYqExMJ0l3OvdA9jtxxGnIMZz6eTkQDAkRZcc3nGBtygiQ2q9JwNAAzGxhh5ya6aZg3AZcLlgGXzVeU-4rKqN9HqsAhVEbXkVltf--UhKn2Iav8V-67ddW2893WbLyl6zMaPWeT8dk-hpXDNLsq8bujmJ4fs_flpnr3Gs7eXaTaZxQ6lbmOBciEIMRVKplLnSWpkglikIIXmCSQG0DmTiyKXuHAGKQetiAq9cARO4pA9nHZ3wX921LR2UzWO6jrfku8aK4xSqUL4H9RKJanmPXj_B1z7Lmz7E1ZrCQZAH9fGJ8gF3zSBSrsL1SYPB8vBHtXbXr09qrcn9X3j7tSoiOiXFkpzjfgNPS99IQ</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>884090080</pqid></control><display><type>article</type><title>Thick-film hybrid technology for low-output-voltage DC/DC converter</title><source>IEEE Electronic Library (IEL)</source><creator>Pernia, A.M. ; Prieto, M.J. ; Lopera, J.M. ; Reilly, J. ; Linton, S.S. ; Quinones, C.</creator><creatorcontrib>Pernia, A.M. ; Prieto, M.J. ; Lopera, J.M. ; Reilly, J. ; Linton, S.S. ; Quinones, C.</creatorcontrib><description>The new requirements in portable and telecommunication equipment also affect the supply systems. The current tendency to lower the output voltage (3.3, 2.7 V/sub DC/) together with the necessity of an important size reduction is modifying the strategies for dc/dc converter implementation. Low-voltage high-power-density applications present two important factors that must be analyzed: thermal problems due to high power density, and the high currents to be handled. This paper presents a 10-W dc/dc buck converter with passive integration using hybrid technology (within the frame of ESPRIT Project 23910.). As a result of the mentioned integration technique, a power density of 6.25 W/cm/sup 3/ was obtained with high efficiency (approximately 90%).</description><identifier>ISSN: 0093-9994</identifier><identifier>EISSN: 1939-9367</identifier><identifier>DOI: 10.1109/TIA.2003.821814</identifier><identifier>CODEN: ITIACR</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>Buck converters ; Capacitors ; Conducting materials ; DC-DC power converters ; Frequency ; Industry Applications Society ; Low voltage ; Substrates ; Thermal factors</subject><ispartof>IEEE transactions on industry applications, 2004-01, Vol.40 (1), p.86-93</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2004</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c348t-234b2e337264748a5794533d704281505903cc9a2da43bc93ea086eed8bce0c43</citedby><cites>FETCH-LOGICAL-c348t-234b2e337264748a5794533d704281505903cc9a2da43bc93ea086eed8bce0c43</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/1268183$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,780,784,796,27923,27924,54757</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/1268183$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Pernia, A.M.</creatorcontrib><creatorcontrib>Prieto, M.J.</creatorcontrib><creatorcontrib>Lopera, J.M.</creatorcontrib><creatorcontrib>Reilly, J.</creatorcontrib><creatorcontrib>Linton, S.S.</creatorcontrib><creatorcontrib>Quinones, C.</creatorcontrib><title>Thick-film hybrid technology for low-output-voltage DC/DC converter</title><title>IEEE transactions on industry applications</title><addtitle>TIA</addtitle><description>The new requirements in portable and telecommunication equipment also affect the supply systems. The current tendency to lower the output voltage (3.3, 2.7 V/sub DC/) together with the necessity of an important size reduction is modifying the strategies for dc/dc converter implementation. Low-voltage high-power-density applications present two important factors that must be analyzed: thermal problems due to high power density, and the high currents to be handled. This paper presents a 10-W dc/dc buck converter with passive integration using hybrid technology (within the frame of ESPRIT Project 23910.). As a result of the mentioned integration technique, a power density of 6.25 W/cm/sup 3/ was obtained with high efficiency (approximately 90%).</description><subject>Buck converters</subject><subject>Capacitors</subject><subject>Conducting materials</subject><subject>DC-DC power converters</subject><subject>Frequency</subject><subject>Industry Applications Society</subject><subject>Low voltage</subject><subject>Substrates</subject><subject>Thermal factors</subject><issn>0093-9994</issn><issn>1939-9367</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2004</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNqFkD1PwzAURS0EEqUwM7BEDGxpn_0cxx6r8FWpEkuZrdR5aVPSujhJUf89qYqExMJ0l3OvdA9jtxxGnIMZz6eTkQDAkRZcc3nGBtygiQ2q9JwNAAzGxhh5ya6aZg3AZcLlgGXzVeU-4rKqN9HqsAhVEbXkVltf--UhKn2Iav8V-67ddW2893WbLyl6zMaPWeT8dk-hpXDNLsq8bujmJ4fs_flpnr3Gs7eXaTaZxQ6lbmOBciEIMRVKplLnSWpkglikIIXmCSQG0DmTiyKXuHAGKQetiAq9cARO4pA9nHZ3wX921LR2UzWO6jrfku8aK4xSqUL4H9RKJanmPXj_B1z7Lmz7E1ZrCQZAH9fGJ8gF3zSBSrsL1SYPB8vBHtXbXr09qrcn9X3j7tSoiOiXFkpzjfgNPS99IQ</recordid><startdate>200401</startdate><enddate>200401</enddate><creator>Pernia, A.M.</creator><creator>Prieto, M.J.</creator><creator>Lopera, J.M.</creator><creator>Reilly, J.</creator><creator>Linton, S.S.</creator><creator>Quinones, C.</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SC</scope><scope>7SP</scope><scope>8FD</scope><scope>JQ2</scope><scope>L7M</scope><scope>L~C</scope><scope>L~D</scope><scope>7TB</scope><scope>FR3</scope></search><sort><creationdate>200401</creationdate><title>Thick-film hybrid technology for low-output-voltage DC/DC converter</title><author>Pernia, A.M. ; Prieto, M.J. ; Lopera, J.M. ; Reilly, J. ; Linton, S.S. ; Quinones, C.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c348t-234b2e337264748a5794533d704281505903cc9a2da43bc93ea086eed8bce0c43</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2004</creationdate><topic>Buck converters</topic><topic>Capacitors</topic><topic>Conducting materials</topic><topic>DC-DC power converters</topic><topic>Frequency</topic><topic>Industry Applications Society</topic><topic>Low voltage</topic><topic>Substrates</topic><topic>Thermal factors</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Pernia, A.M.</creatorcontrib><creatorcontrib>Prieto, M.J.</creatorcontrib><creatorcontrib>Lopera, J.M.</creatorcontrib><creatorcontrib>Reilly, J.</creatorcontrib><creatorcontrib>Linton, S.S.</creatorcontrib><creatorcontrib>Quinones, C.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>CrossRef</collection><collection>Computer and Information Systems Abstracts</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>ProQuest Computer Science Collection</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Computer and Information Systems Abstracts Academic</collection><collection>Computer and Information Systems Abstracts Professional</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>Engineering Research Database</collection><jtitle>IEEE transactions on industry applications</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Pernia, A.M.</au><au>Prieto, M.J.</au><au>Lopera, J.M.</au><au>Reilly, J.</au><au>Linton, S.S.</au><au>Quinones, C.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Thick-film hybrid technology for low-output-voltage DC/DC converter</atitle><jtitle>IEEE transactions on industry applications</jtitle><stitle>TIA</stitle><date>2004-01</date><risdate>2004</risdate><volume>40</volume><issue>1</issue><spage>86</spage><epage>93</epage><pages>86-93</pages><issn>0093-9994</issn><eissn>1939-9367</eissn><coden>ITIACR</coden><abstract>The new requirements in portable and telecommunication equipment also affect the supply systems. The current tendency to lower the output voltage (3.3, 2.7 V/sub DC/) together with the necessity of an important size reduction is modifying the strategies for dc/dc converter implementation. Low-voltage high-power-density applications present two important factors that must be analyzed: thermal problems due to high power density, and the high currents to be handled. This paper presents a 10-W dc/dc buck converter with passive integration using hybrid technology (within the frame of ESPRIT Project 23910.). As a result of the mentioned integration technique, a power density of 6.25 W/cm/sup 3/ was obtained with high efficiency (approximately 90%).</abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/TIA.2003.821814</doi><tpages>8</tpages></addata></record> |
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subjects | Buck converters Capacitors Conducting materials DC-DC power converters Frequency Industry Applications Society Low voltage Substrates Thermal factors |
title | Thick-film hybrid technology for low-output-voltage DC/DC converter |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-11T23%3A44%3A06IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_RIE&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Thick-film%20hybrid%20technology%20for%20low-output-voltage%20DC/DC%20converter&rft.jtitle=IEEE%20transactions%20on%20industry%20applications&rft.au=Pernia,%20A.M.&rft.date=2004-01&rft.volume=40&rft.issue=1&rft.spage=86&rft.epage=93&rft.pages=86-93&rft.issn=0093-9994&rft.eissn=1939-9367&rft.coden=ITIACR&rft_id=info:doi/10.1109/TIA.2003.821814&rft_dat=%3Cproquest_RIE%3E29667630%3C/proquest_RIE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=884090080&rft_id=info:pmid/&rft_ieee_id=1268183&rfr_iscdi=true |