Thick-film hybrid technology for low-output-voltage DC/DC converter

The new requirements in portable and telecommunication equipment also affect the supply systems. The current tendency to lower the output voltage (3.3, 2.7 V/sub DC/) together with the necessity of an important size reduction is modifying the strategies for dc/dc converter implementation. Low-voltag...

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Veröffentlicht in:IEEE transactions on industry applications 2004-01, Vol.40 (1), p.86-93
Hauptverfasser: Pernia, A.M., Prieto, M.J., Lopera, J.M., Reilly, J., Linton, S.S., Quinones, C.
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container_start_page 86
container_title IEEE transactions on industry applications
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creator Pernia, A.M.
Prieto, M.J.
Lopera, J.M.
Reilly, J.
Linton, S.S.
Quinones, C.
description The new requirements in portable and telecommunication equipment also affect the supply systems. The current tendency to lower the output voltage (3.3, 2.7 V/sub DC/) together with the necessity of an important size reduction is modifying the strategies for dc/dc converter implementation. Low-voltage high-power-density applications present two important factors that must be analyzed: thermal problems due to high power density, and the high currents to be handled. This paper presents a 10-W dc/dc buck converter with passive integration using hybrid technology (within the frame of ESPRIT Project 23910.). As a result of the mentioned integration technique, a power density of 6.25 W/cm/sup 3/ was obtained with high efficiency (approximately 90%).
doi_str_mv 10.1109/TIA.2003.821814
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subjects Buck converters
Capacitors
Conducting materials
DC-DC power converters
Frequency
Industry Applications Society
Low voltage
Substrates
Thermal factors
title Thick-film hybrid technology for low-output-voltage DC/DC converter
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