Bondability Study of Chip-on-Film (COF) Inner Lead Bonding (ILB) Using Conventional Gang Bonder

Inner lead bonding (ILB) is used to thermomechanically join the Cu inner leads on a flexible film tape and Au bumps on a driver IC chip to form electrical paths. With the newly developed film carrier assembly technology, called chip on film (COF), the bumps are prepared separately on a film tape sub...

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Veröffentlicht in:	IEEE transactions on electronics packaging manufacturing 2008-10, Vol.31 (4), p.285-290
Hauptverfasser:	CHEN, Ching-I, NI, Ching-Yu, CHANG, Chi-Min, WU, Shao-Chiun, LIU, De-Shin
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Assembly Bondability Bonding Bonding strength chip on film (COF) Chips Design. Technologies. Operation analysis. Testing Drivers Electronics Exact sciences and technology Glass inner lead bonding (ILB) Integrated circuit packaging Integrated circuits Liquid crystal displays Mechanical engineering Peeling peeling test Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Strength Substrates Testing Thermomechanical processes Thin film transistors
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