Wafer-applied underfill: flip-chip assembly and reliability

Manufacturers of consumer electronic products are continuously striving to confer greater functionality to smaller, lighter, and less expensive packages, and flip-chip is an important enabling technology for these product trends. Underfill between the die and an organic substrate is necessary to com...

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Veröffentlicht in:	IEEE transactions on electronics packaging manufacturing 2004-04, Vol.27 (2), p.101-108
Hauptverfasser:	Johnson, R.W., Qing Wang, Fei Ding, Zhenwei Hou, Crane, L., Hao Tang, Shi, G., Renzhe Zhao, Danvir, J., Jing Qi
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Assembly Consumer electronics Design. Technologies. Operation analysis. Testing Electronic packaging thermal management Electronics Exact sciences and technology Flip-chip Integrated circuits Manufacturing preapplied Production facilities Sawing Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Space technology Surface-mount technology Testing Testing, measurement, noise and reliability Thermal expansion underfill wafer-applied
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