Analytical Model and New Structure of the Variable- k Dielectric Trench LDMOS With Improved Breakdown Voltage and Specific ON-Resistance
A novel Silicon-on-Insulator laterally double-diffused metal-oxide-semiconductor transistor with ultralow specific ON-resistance (R ON,sp ) is proposed, and its analytical model for the breakdown voltage (BV) is presented. The device features a variable-k dielectric trench and a p-pillar beside the...
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Veröffentlicht in: | IEEE transactions on electron devices 2015-10, Vol.62 (10), p.3334-3340 |
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creator | Zhou, Kun Luo, Xiaorong Li, Zhaoji Zhang, Bo |
description | A novel Silicon-on-Insulator laterally double-diffused metal-oxide-semiconductor transistor with ultralow specific ON-resistance (R ON,sp ) is proposed, and its analytical model for the breakdown voltage (BV) is presented. The device features a variable-k dielectric trench and a p-pillar beside the trench (VK-P). First, the VK trench induces additional field peaks and thus significantly increases the average electric field (E-field) strength. Second, the low-k dielectric in the upper trench leads to a high E-field strength, enabling a shortened device pitch to support the high BV. Third, the p-pillar extending from the p-body to the trench bottom not only acts as the vertical junction termination extension, but also forms the enhanced vertical reduced surface field effect, which further modulates the E-field distribution and increases the drift doping concentration. The BV and R ON,sp are, therefore, greatly improved. At 600 V class BV, the VK-P LDMOS reduces the R ON,sp by 54% compared with the uniform-k trench LDMOS. An analytical BV model taking account of influence of the VK dielectric trench is presented for the first time. The analytical results agree well with the simulated results. |
doi_str_mv | 10.1109/TED.2015.2466694 |
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The device features a variable-k dielectric trench and a p-pillar beside the trench (VK-P). First, the VK trench induces additional field peaks and thus significantly increases the average electric field (E-field) strength. Second, the low-k dielectric in the upper trench leads to a high E-field strength, enabling a shortened device pitch to support the high BV. Third, the p-pillar extending from the p-body to the trench bottom not only acts as the vertical junction termination extension, but also forms the enhanced vertical reduced surface field effect, which further modulates the E-field distribution and increases the drift doping concentration. The BV and R ON,sp are, therefore, greatly improved. At 600 V class BV, the VK-P LDMOS reduces the R ON,sp by 54% compared with the uniform-k trench LDMOS. An analytical BV model taking account of influence of the VK dielectric trench is presented for the first time. The analytical results agree well with the simulated results.</description><identifier>ISSN: 0018-9383</identifier><identifier>EISSN: 1557-9646</identifier><identifier>DOI: 10.1109/TED.2015.2466694</identifier><identifier>CODEN: IETDAI</identifier><language>eng</language><publisher>IEEE</publisher><subject>Analytical models ; Breakdown voltage (BV) ; Dielectrics ; Electric breakdown ; Fabrication ; LDMOS ; Logic gates ; Mathematical model ; reduced surface field (RESURF) ; Silicon ; specific ON-resistance ; trench ; variable-k (VK)</subject><ispartof>IEEE transactions on electron devices, 2015-10, Vol.62 (10), p.3334-3340</ispartof><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c333t-4d2a72e481d899dfe7ce0481bb6ccb7e23cb46f75fdfdb039f4c7c0e596561143</citedby><cites>FETCH-LOGICAL-c333t-4d2a72e481d899dfe7ce0481bb6ccb7e23cb46f75fdfdb039f4c7c0e596561143</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/7214271$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,776,780,792,27901,27902,54733</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/7214271$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Zhou, Kun</creatorcontrib><creatorcontrib>Luo, Xiaorong</creatorcontrib><creatorcontrib>Li, Zhaoji</creatorcontrib><creatorcontrib>Zhang, Bo</creatorcontrib><title>Analytical Model and New Structure of the Variable- k Dielectric Trench LDMOS With Improved Breakdown Voltage and Specific ON-Resistance</title><title>IEEE transactions on electron devices</title><addtitle>TED</addtitle><description>A novel Silicon-on-Insulator laterally double-diffused metal-oxide-semiconductor transistor with ultralow specific ON-resistance (R ON,sp ) is proposed, and its analytical model for the breakdown voltage (BV) is presented. The device features a variable-k dielectric trench and a p-pillar beside the trench (VK-P). First, the VK trench induces additional field peaks and thus significantly increases the average electric field (E-field) strength. Second, the low-k dielectric in the upper trench leads to a high E-field strength, enabling a shortened device pitch to support the high BV. Third, the p-pillar extending from the p-body to the trench bottom not only acts as the vertical junction termination extension, but also forms the enhanced vertical reduced surface field effect, which further modulates the E-field distribution and increases the drift doping concentration. The BV and R ON,sp are, therefore, greatly improved. At 600 V class BV, the VK-P LDMOS reduces the R ON,sp by 54% compared with the uniform-k trench LDMOS. An analytical BV model taking account of influence of the VK dielectric trench is presented for the first time. The analytical results agree well with the simulated results.</description><subject>Analytical models</subject><subject>Breakdown voltage (BV)</subject><subject>Dielectrics</subject><subject>Electric breakdown</subject><subject>Fabrication</subject><subject>LDMOS</subject><subject>Logic gates</subject><subject>Mathematical model</subject><subject>reduced surface field (RESURF)</subject><subject>Silicon</subject><subject>specific ON-resistance</subject><subject>trench</subject><subject>variable-k (VK)</subject><issn>0018-9383</issn><issn>1557-9646</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2015</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNo9kN9OwjAchRujiYjem3jTFxi2a9eySwRUEv4kgni5dO2vUhkb6YqEN_CxHUK8OjnJ-c7Fh9A9JR1KSfq4GA46MaFJJ-ZCiJRfoBZNEhmlgotL1CKEdqOUddk1uqnrr6YKzuMW-umVqjgEp1WBJ5WBAqvS4Cns8Tz4nQ47D7iyOKwAL5V3Ki8gwms8cFCADt5pvPBQ6hUeDyazOf5wYYVHm62vvsHgJw9qbap9iZdVEdQn_J3Pt6CdbcjZNHqD2tVBlRpu0ZVVRQ1352yj9-fhov8ajWcvo35vHGnGWIi4iZWMgXep6aapsSA1kKbludA6lxAznXNhZWKNNTlhqeVaagJJKhJBKWdtRE6_2ld17cFmW-82yh8ySrKjyawxmR1NZmeTDfJwQhwA_M9lTHksKfsFZdlwrg</recordid><startdate>20151001</startdate><enddate>20151001</enddate><creator>Zhou, Kun</creator><creator>Luo, Xiaorong</creator><creator>Li, Zhaoji</creator><creator>Zhang, Bo</creator><general>IEEE</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>20151001</creationdate><title>Analytical Model and New Structure of the Variable- k Dielectric Trench LDMOS With Improved Breakdown Voltage and Specific ON-Resistance</title><author>Zhou, Kun ; Luo, Xiaorong ; Li, Zhaoji ; Zhang, Bo</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c333t-4d2a72e481d899dfe7ce0481bb6ccb7e23cb46f75fdfdb039f4c7c0e596561143</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2015</creationdate><topic>Analytical models</topic><topic>Breakdown voltage (BV)</topic><topic>Dielectrics</topic><topic>Electric breakdown</topic><topic>Fabrication</topic><topic>LDMOS</topic><topic>Logic gates</topic><topic>Mathematical model</topic><topic>reduced surface field (RESURF)</topic><topic>Silicon</topic><topic>specific ON-resistance</topic><topic>trench</topic><topic>variable-k (VK)</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Zhou, Kun</creatorcontrib><creatorcontrib>Luo, Xiaorong</creatorcontrib><creatorcontrib>Li, Zhaoji</creatorcontrib><creatorcontrib>Zhang, Bo</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>CrossRef</collection><jtitle>IEEE transactions on electron devices</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Zhou, Kun</au><au>Luo, Xiaorong</au><au>Li, Zhaoji</au><au>Zhang, Bo</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Analytical Model and New Structure of the Variable- k Dielectric Trench LDMOS With Improved Breakdown Voltage and Specific ON-Resistance</atitle><jtitle>IEEE transactions on electron devices</jtitle><stitle>TED</stitle><date>2015-10-01</date><risdate>2015</risdate><volume>62</volume><issue>10</issue><spage>3334</spage><epage>3340</epage><pages>3334-3340</pages><issn>0018-9383</issn><eissn>1557-9646</eissn><coden>IETDAI</coden><abstract>A novel Silicon-on-Insulator laterally double-diffused metal-oxide-semiconductor transistor with ultralow specific ON-resistance (R ON,sp ) is proposed, and its analytical model for the breakdown voltage (BV) is presented. The device features a variable-k dielectric trench and a p-pillar beside the trench (VK-P). First, the VK trench induces additional field peaks and thus significantly increases the average electric field (E-field) strength. Second, the low-k dielectric in the upper trench leads to a high E-field strength, enabling a shortened device pitch to support the high BV. Third, the p-pillar extending from the p-body to the trench bottom not only acts as the vertical junction termination extension, but also forms the enhanced vertical reduced surface field effect, which further modulates the E-field distribution and increases the drift doping concentration. The BV and R ON,sp are, therefore, greatly improved. At 600 V class BV, the VK-P LDMOS reduces the R ON,sp by 54% compared with the uniform-k trench LDMOS. An analytical BV model taking account of influence of the VK dielectric trench is presented for the first time. The analytical results agree well with the simulated results.</abstract><pub>IEEE</pub><doi>10.1109/TED.2015.2466694</doi><tpages>7</tpages></addata></record> |
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subjects | Analytical models Breakdown voltage (BV) Dielectrics Electric breakdown Fabrication LDMOS Logic gates Mathematical model reduced surface field (RESURF) Silicon specific ON-resistance trench variable-k (VK) |
title | Analytical Model and New Structure of the Variable- k Dielectric Trench LDMOS With Improved Breakdown Voltage and Specific ON-Resistance |
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