Analytical Model and New Structure of the Variable- k Dielectric Trench LDMOS With Improved Breakdown Voltage and Specific ON-Resistance

A novel Silicon-on-Insulator laterally double-diffused metal-oxide-semiconductor transistor with ultralow specific ON-resistance (R ON,sp ) is proposed, and its analytical model for the breakdown voltage (BV) is presented. The device features a variable-k dielectric trench and a p-pillar beside the...

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Veröffentlicht in:IEEE transactions on electron devices 2015-10, Vol.62 (10), p.3334-3340
Hauptverfasser: Zhou, Kun, Luo, Xiaorong, Li, Zhaoji, Zhang, Bo
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container_issue 10
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container_title IEEE transactions on electron devices
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creator Zhou, Kun
Luo, Xiaorong
Li, Zhaoji
Zhang, Bo
description A novel Silicon-on-Insulator laterally double-diffused metal-oxide-semiconductor transistor with ultralow specific ON-resistance (R ON,sp ) is proposed, and its analytical model for the breakdown voltage (BV) is presented. The device features a variable-k dielectric trench and a p-pillar beside the trench (VK-P). First, the VK trench induces additional field peaks and thus significantly increases the average electric field (E-field) strength. Second, the low-k dielectric in the upper trench leads to a high E-field strength, enabling a shortened device pitch to support the high BV. Third, the p-pillar extending from the p-body to the trench bottom not only acts as the vertical junction termination extension, but also forms the enhanced vertical reduced surface field effect, which further modulates the E-field distribution and increases the drift doping concentration. The BV and R ON,sp are, therefore, greatly improved. At 600 V class BV, the VK-P LDMOS reduces the R ON,sp by 54% compared with the uniform-k trench LDMOS. An analytical BV model taking account of influence of the VK dielectric trench is presented for the first time. The analytical results agree well with the simulated results.
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The device features a variable-k dielectric trench and a p-pillar beside the trench (VK-P). First, the VK trench induces additional field peaks and thus significantly increases the average electric field (E-field) strength. Second, the low-k dielectric in the upper trench leads to a high E-field strength, enabling a shortened device pitch to support the high BV. Third, the p-pillar extending from the p-body to the trench bottom not only acts as the vertical junction termination extension, but also forms the enhanced vertical reduced surface field effect, which further modulates the E-field distribution and increases the drift doping concentration. The BV and R ON,sp are, therefore, greatly improved. At 600 V class BV, the VK-P LDMOS reduces the R ON,sp by 54% compared with the uniform-k trench LDMOS. An analytical BV model taking account of influence of the VK dielectric trench is presented for the first time. 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The device features a variable-k dielectric trench and a p-pillar beside the trench (VK-P). First, the VK trench induces additional field peaks and thus significantly increases the average electric field (E-field) strength. Second, the low-k dielectric in the upper trench leads to a high E-field strength, enabling a shortened device pitch to support the high BV. Third, the p-pillar extending from the p-body to the trench bottom not only acts as the vertical junction termination extension, but also forms the enhanced vertical reduced surface field effect, which further modulates the E-field distribution and increases the drift doping concentration. The BV and R ON,sp are, therefore, greatly improved. At 600 V class BV, the VK-P LDMOS reduces the R ON,sp by 54% compared with the uniform-k trench LDMOS. An analytical BV model taking account of influence of the VK dielectric trench is presented for the first time. 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The device features a variable-k dielectric trench and a p-pillar beside the trench (VK-P). First, the VK trench induces additional field peaks and thus significantly increases the average electric field (E-field) strength. Second, the low-k dielectric in the upper trench leads to a high E-field strength, enabling a shortened device pitch to support the high BV. Third, the p-pillar extending from the p-body to the trench bottom not only acts as the vertical junction termination extension, but also forms the enhanced vertical reduced surface field effect, which further modulates the E-field distribution and increases the drift doping concentration. The BV and R ON,sp are, therefore, greatly improved. At 600 V class BV, the VK-P LDMOS reduces the R ON,sp by 54% compared with the uniform-k trench LDMOS. An analytical BV model taking account of influence of the VK dielectric trench is presented for the first time. The analytical results agree well with the simulated results.</abstract><pub>IEEE</pub><doi>10.1109/TED.2015.2466694</doi><tpages>7</tpages></addata></record>
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subjects Analytical models
Breakdown voltage (BV)
Dielectrics
Electric breakdown
Fabrication
LDMOS
Logic gates
Mathematical model
reduced surface field (RESURF)
Silicon
specific ON-resistance
trench
variable-k (VK)
title Analytical Model and New Structure of the Variable- k Dielectric Trench LDMOS With Improved Breakdown Voltage and Specific ON-Resistance
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