A Charge Transfer Model for CMOS Image Sensors

Based on the thermionic emission theory, a charge transfer model has been developed which describes the charge transfer process between a pinned photodiode and floating diffusion (FD) node for CMOS image sensors. To simulate the model, an iterative method is used. The model shows that the charge tra...

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Veröffentlicht in:IEEE transactions on electron devices 2016-01, Vol.63 (1), p.32-41
Hauptverfasser: Liqiang Han, Suying Yao, Theuwissen, Albert J. P.
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Theuwissen, Albert J. P.
description Based on the thermionic emission theory, a charge transfer model has been developed which describes the charge transfer process between a pinned photodiode and floating diffusion (FD) node for CMOS image sensors. To simulate the model, an iterative method is used. The model shows that the charge transfer time, barrier height, and reset voltage of the FD node affect the charge transfer process. The corresponding measurement results obtained from two different test chips are presented in this paper. The model also predicts that other physical parameters, such as the capacitance of the FD node and the area of the photodiode, will affect the charge transfer. Furthermore, the model can be extended to explain the pinning voltage measurement method and the feedforward effect.
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fullrecord <record><control><sourceid>proquest_RIE</sourceid><recordid>TN_cdi_crossref_primary_10_1109_TED_2015_2451593</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>7169526</ieee_id><sourcerecordid>1816060717</sourcerecordid><originalsourceid>FETCH-LOGICAL-c394t-4387952129495030a4002339ce74ab283f0dfadae6f12ff56c4535958d490a903</originalsourceid><addsrcrecordid>eNpdkDtPwzAQgC0EEqWwI7FEYmFJuPMr9liFApVadWiZLZPY0CpNit0O_Pu6asXAdDrdd6-PkHuEAhH083L8UlBAUVAuUGh2QQYoRJlryeUlGQCgyjVT7JrcxLhOqeScDkgxyqpvG75ctgy2i96FbNY3rs18H7JqNl9kk41N1YXrYh_iLbnyto3u7hyH5ON1vKze8-n8bVKNpnnNNN_lnKlSC4pUcy2AgeUAlDFdu5LbT6qYh8bbxjrpkXovZM0FE1qohmuwGtiQPJ3mbkP_s3dxZzarWLu2tZ3r99GgQgkSSiwT-vgPXff70KXrDJaCAqTdKlFwourQxxicN9uw2tjwaxDMUaBJAs1RoDkLTC0Pp5aVc-4PL1GmzyQ7AAthZ0U</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>1752004008</pqid></control><display><type>article</type><title>A Charge Transfer Model for CMOS Image Sensors</title><source>IEEE Electronic Library (IEL)</source><creator>Liqiang Han ; Suying Yao ; Theuwissen, Albert J. P.</creator><creatorcontrib>Liqiang Han ; Suying Yao ; Theuwissen, Albert J. P.</creatorcontrib><description>Based on the thermionic emission theory, a charge transfer model has been developed which describes the charge transfer process between a pinned photodiode and floating diffusion (FD) node for CMOS image sensors. To simulate the model, an iterative method is used. The model shows that the charge transfer time, barrier height, and reset voltage of the FD node affect the charge transfer process. The corresponding measurement results obtained from two different test chips are presented in this paper. The model also predicts that other physical parameters, such as the capacitance of the FD node and the area of the photodiode, will affect the charge transfer. Furthermore, the model can be extended to explain the pinning voltage measurement method and the feedforward effect.</description><identifier>ISSN: 0018-9383</identifier><identifier>EISSN: 1557-9646</identifier><identifier>DOI: 10.1109/TED.2015.2451593</identifier><identifier>CODEN: IETDAI</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>Charge transfer ; CMOS ; CMOS image sensors (CISs) ; Devices ; Doping ; Electric potential ; Feedforward ; Mathematical model ; Mathematical models ; Photodiodes ; pinned photodiode (PPD) ; Semiconductor device modeling ; Semiconductor process modeling ; Sensors ; Thermionic emission ; thermionic emission theory</subject><ispartof>IEEE transactions on electron devices, 2016-01, Vol.63 (1), p.32-41</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2016</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c394t-4387952129495030a4002339ce74ab283f0dfadae6f12ff56c4535958d490a903</citedby><cites>FETCH-LOGICAL-c394t-4387952129495030a4002339ce74ab283f0dfadae6f12ff56c4535958d490a903</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/7169526$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,776,780,792,27903,27904,54737</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/7169526$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Liqiang Han</creatorcontrib><creatorcontrib>Suying Yao</creatorcontrib><creatorcontrib>Theuwissen, Albert J. P.</creatorcontrib><title>A Charge Transfer Model for CMOS Image Sensors</title><title>IEEE transactions on electron devices</title><addtitle>TED</addtitle><description>Based on the thermionic emission theory, a charge transfer model has been developed which describes the charge transfer process between a pinned photodiode and floating diffusion (FD) node for CMOS image sensors. To simulate the model, an iterative method is used. The model shows that the charge transfer time, barrier height, and reset voltage of the FD node affect the charge transfer process. The corresponding measurement results obtained from two different test chips are presented in this paper. The model also predicts that other physical parameters, such as the capacitance of the FD node and the area of the photodiode, will affect the charge transfer. Furthermore, the model can be extended to explain the pinning voltage measurement method and the feedforward effect.</description><subject>Charge transfer</subject><subject>CMOS</subject><subject>CMOS image sensors (CISs)</subject><subject>Devices</subject><subject>Doping</subject><subject>Electric potential</subject><subject>Feedforward</subject><subject>Mathematical model</subject><subject>Mathematical models</subject><subject>Photodiodes</subject><subject>pinned photodiode (PPD)</subject><subject>Semiconductor device modeling</subject><subject>Semiconductor process modeling</subject><subject>Sensors</subject><subject>Thermionic emission</subject><subject>thermionic emission theory</subject><issn>0018-9383</issn><issn>1557-9646</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2016</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNpdkDtPwzAQgC0EEqWwI7FEYmFJuPMr9liFApVadWiZLZPY0CpNit0O_Pu6asXAdDrdd6-PkHuEAhH083L8UlBAUVAuUGh2QQYoRJlryeUlGQCgyjVT7JrcxLhOqeScDkgxyqpvG75ctgy2i96FbNY3rs18H7JqNl9kk41N1YXrYh_iLbnyto3u7hyH5ON1vKze8-n8bVKNpnnNNN_lnKlSC4pUcy2AgeUAlDFdu5LbT6qYh8bbxjrpkXovZM0FE1qohmuwGtiQPJ3mbkP_s3dxZzarWLu2tZ3r99GgQgkSSiwT-vgPXff70KXrDJaCAqTdKlFwourQxxicN9uw2tjwaxDMUaBJAs1RoDkLTC0Pp5aVc-4PL1GmzyQ7AAthZ0U</recordid><startdate>20160101</startdate><enddate>20160101</enddate><creator>Liqiang Han</creator><creator>Suying Yao</creator><creator>Theuwissen, Albert J. P.</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope><scope>F28</scope><scope>FR3</scope></search><sort><creationdate>20160101</creationdate><title>A Charge Transfer Model for CMOS Image Sensors</title><author>Liqiang Han ; Suying Yao ; Theuwissen, Albert J. P.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c394t-4387952129495030a4002339ce74ab283f0dfadae6f12ff56c4535958d490a903</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2016</creationdate><topic>Charge transfer</topic><topic>CMOS</topic><topic>CMOS image sensors (CISs)</topic><topic>Devices</topic><topic>Doping</topic><topic>Electric potential</topic><topic>Feedforward</topic><topic>Mathematical model</topic><topic>Mathematical models</topic><topic>Photodiodes</topic><topic>pinned photodiode (PPD)</topic><topic>Semiconductor device modeling</topic><topic>Semiconductor process modeling</topic><topic>Sensors</topic><topic>Thermionic emission</topic><topic>thermionic emission theory</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Liqiang Han</creatorcontrib><creatorcontrib>Suying Yao</creatorcontrib><creatorcontrib>Theuwissen, Albert J. P.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>CrossRef</collection><collection>Electronics &amp; Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>ANTE: Abstracts in New Technology &amp; Engineering</collection><collection>Engineering Research Database</collection><jtitle>IEEE transactions on electron devices</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Liqiang Han</au><au>Suying Yao</au><au>Theuwissen, Albert J. P.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>A Charge Transfer Model for CMOS Image Sensors</atitle><jtitle>IEEE transactions on electron devices</jtitle><stitle>TED</stitle><date>2016-01-01</date><risdate>2016</risdate><volume>63</volume><issue>1</issue><spage>32</spage><epage>41</epage><pages>32-41</pages><issn>0018-9383</issn><eissn>1557-9646</eissn><coden>IETDAI</coden><abstract>Based on the thermionic emission theory, a charge transfer model has been developed which describes the charge transfer process between a pinned photodiode and floating diffusion (FD) node for CMOS image sensors. To simulate the model, an iterative method is used. The model shows that the charge transfer time, barrier height, and reset voltage of the FD node affect the charge transfer process. The corresponding measurement results obtained from two different test chips are presented in this paper. The model also predicts that other physical parameters, such as the capacitance of the FD node and the area of the photodiode, will affect the charge transfer. Furthermore, the model can be extended to explain the pinning voltage measurement method and the feedforward effect.</abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/TED.2015.2451593</doi><tpages>10</tpages></addata></record>
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subjects Charge transfer
CMOS
CMOS image sensors (CISs)
Devices
Doping
Electric potential
Feedforward
Mathematical model
Mathematical models
Photodiodes
pinned photodiode (PPD)
Semiconductor device modeling
Semiconductor process modeling
Sensors
Thermionic emission
thermionic emission theory
title A Charge Transfer Model for CMOS Image Sensors
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-22T01%3A58%3A26IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_RIE&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=A%20Charge%20Transfer%20Model%20for%20CMOS%20Image%20Sensors&rft.jtitle=IEEE%20transactions%20on%20electron%20devices&rft.au=Liqiang%20Han&rft.date=2016-01-01&rft.volume=63&rft.issue=1&rft.spage=32&rft.epage=41&rft.pages=32-41&rft.issn=0018-9383&rft.eissn=1557-9646&rft.coden=IETDAI&rft_id=info:doi/10.1109/TED.2015.2451593&rft_dat=%3Cproquest_RIE%3E1816060717%3C/proquest_RIE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=1752004008&rft_id=info:pmid/&rft_ieee_id=7169526&rfr_iscdi=true