Analysis of Repetitive Bending on Flexible Wireless Power Transfer (WPT) PCB Coils for Flexible Wearable Devices
In this article, we first designed, measured, and analyzed flexible wireless power transfer (WPT) coils with repetitive bending cycles. To analyze any changes in electrical characteristics through repetitive bending cycles, 3\times3 cm flexible printed circuit board (PCB) coils were fabricated usi...
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| Veröffentlicht in: | IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2022-11, Vol.12 (11), p.1748-1756 |
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| creator | Jeong, Seungtaek Kim, Tae-Wook Lee, Seongsoo Sim, Boogyo Park, Hyunwook Son, Kyungjune Son, Keeyoung Kim, Seongguk Shin, Taein Kim, Young-Cheon Kim, Joungho Kim, Byoung-Joon |
| description | In this article, we first designed, measured, and analyzed flexible wireless power transfer (WPT) coils with repetitive bending cycles. To analyze any changes in electrical characteristics through repetitive bending cycles, 3\times3 cm flexible printed circuit board (PCB) coils were fabricated using polyimide substrates. Different coil configurations are designed to find a mechanically robust, flexible PCB coil design. First, we analyzed single-layer and double-layer coils. Generally, via is the mechanically weakest part of the PCB, hence the diameter of the via varies to observe the effect of repetitive bending cycle. Ten thousand bending cycles with a bending radius of 3 mm and a bending cycle frequency of 1 Hz were used to analyze the electrical changes. Moreover, the bending position of the coil is varied to observe the bending effect. The flexible coil's direct current (dc) resistance is measured during the bending cycle. After the repetitive bending test is completed, the coil impedance is analyzed in a frequency domain. As a result, we conclude that the flexible WPT coil is robust from mechanical stress when the layer of the coil is single a layer, the bending line is applied vertically, and the diameter of the via is small. |
| doi_str_mv | 10.1109/TCPMT.2022.3217291 |
| format | Article |
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To analyze any changes in electrical characteristics through repetitive bending cycles, <inline-formula> <tex-math notation="LaTeX">3\times3 </tex-math></inline-formula> cm flexible printed circuit board (PCB) coils were fabricated using polyimide substrates. Different coil configurations are designed to find a mechanically robust, flexible PCB coil design. First, we analyzed single-layer and double-layer coils. Generally, via is the mechanically weakest part of the PCB, hence the diameter of the via varies to observe the effect of repetitive bending cycle. Ten thousand bending cycles with a bending radius of 3 mm and a bending cycle frequency of 1 Hz were used to analyze the electrical changes. Moreover, the bending position of the coil is varied to observe the bending effect. The flexible coil's direct current (dc) resistance is measured during the bending cycle. After the repetitive bending test is completed, the coil impedance is analyzed in a frequency domain. As a result, we conclude that the flexible WPT coil is robust from mechanical stress when the layer of the coil is single a layer, the bending line is applied vertically, and the diameter of the via is small.</description><identifier>ISSN: 2156-3950</identifier><identifier>EISSN: 2156-3985</identifier><identifier>DOI: 10.1109/TCPMT.2022.3217291</identifier><identifier>CODEN: ITCPC8</identifier><language>eng</language><publisher>Piscataway: IEEE</publisher><subject>Bend radius ; Bending ; Circuit boards ; Coils ; Diameters ; Direct current ; Flexible printed circuit board (FPCB) coils ; Flexible printed circuits ; flexible wearable device ; Printed circuits ; repetitive bending ; Robustness ; Substrates ; Wearable computers ; Wearable technology ; Wireless power transfer ; wireless power transfer (WPT) ; Wireless power transmission</subject><ispartof>IEEE transactions on components, packaging, and manufacturing technology (2011), 2022-11, Vol.12 (11), p.1748-1756</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2022</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c295t-8105438b7e9f854a48da73e1f9fce0a5a000199b968909a65770dcaaa0c531b73</citedby><cites>FETCH-LOGICAL-c295t-8105438b7e9f854a48da73e1f9fce0a5a000199b968909a65770dcaaa0c531b73</cites><orcidid>0000-0003-1040-4458 ; 0000-0003-2720-7573 ; 0000-0001-7003-5207 ; 0000-0003-1376-0781 ; 0000-0003-3019-3678 ; 0000-0002-8925-2604 ; 0000-0002-9944-9822 ; 0000-0001-9356-3635</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/9930768$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>315,781,785,797,27928,27929,54762</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/9930768$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Jeong, Seungtaek</creatorcontrib><creatorcontrib>Kim, Tae-Wook</creatorcontrib><creatorcontrib>Lee, Seongsoo</creatorcontrib><creatorcontrib>Sim, Boogyo</creatorcontrib><creatorcontrib>Park, Hyunwook</creatorcontrib><creatorcontrib>Son, Kyungjune</creatorcontrib><creatorcontrib>Son, Keeyoung</creatorcontrib><creatorcontrib>Kim, Seongguk</creatorcontrib><creatorcontrib>Shin, Taein</creatorcontrib><creatorcontrib>Kim, Young-Cheon</creatorcontrib><creatorcontrib>Kim, Joungho</creatorcontrib><creatorcontrib>Kim, Byoung-Joon</creatorcontrib><title>Analysis of Repetitive Bending on Flexible Wireless Power Transfer (WPT) PCB Coils for Flexible Wearable Devices</title><title>IEEE transactions on components, packaging, and manufacturing technology (2011)</title><addtitle>TCPMT</addtitle><description>In this article, we first designed, measured, and analyzed flexible wireless power transfer (WPT) coils with repetitive bending cycles. To analyze any changes in electrical characteristics through repetitive bending cycles, <inline-formula> <tex-math notation="LaTeX">3\times3 </tex-math></inline-formula> cm flexible printed circuit board (PCB) coils were fabricated using polyimide substrates. Different coil configurations are designed to find a mechanically robust, flexible PCB coil design. First, we analyzed single-layer and double-layer coils. Generally, via is the mechanically weakest part of the PCB, hence the diameter of the via varies to observe the effect of repetitive bending cycle. Ten thousand bending cycles with a bending radius of 3 mm and a bending cycle frequency of 1 Hz were used to analyze the electrical changes. Moreover, the bending position of the coil is varied to observe the bending effect. The flexible coil's direct current (dc) resistance is measured during the bending cycle. After the repetitive bending test is completed, the coil impedance is analyzed in a frequency domain. As a result, we conclude that the flexible WPT coil is robust from mechanical stress when the layer of the coil is single a layer, the bending line is applied vertically, and the diameter of the via is small.</description><subject>Bend radius</subject><subject>Bending</subject><subject>Circuit boards</subject><subject>Coils</subject><subject>Diameters</subject><subject>Direct current</subject><subject>Flexible printed circuit board (FPCB) coils</subject><subject>Flexible printed circuits</subject><subject>flexible wearable device</subject><subject>Printed circuits</subject><subject>repetitive bending</subject><subject>Robustness</subject><subject>Substrates</subject><subject>Wearable computers</subject><subject>Wearable technology</subject><subject>Wireless power transfer</subject><subject>wireless power transfer (WPT)</subject><subject>Wireless power transmission</subject><issn>2156-3950</issn><issn>2156-3985</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2022</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNpNkE1Lw0AQhoMoWGr_gF4WvOghdT-y2d1jG60KFYNEegybdCJbYrbuptX-exNbinOZ9_A-A_MEwSXBY0KwusuS9CUbU0zpmFEiqCInwYASHodMSX56zByfByPvV7gbLrHAbBCsJ42ud954ZCv0BmtoTWu2gKbQLE3zgWyDZjX8mKIGtDAOavAepfYbHMqcbnzVhZtFmt2iNJmixJrao8q6fxBop_twD1tTgr8Izipdexgd9jB4nz1kyVM4f318TibzsKSKt6EkmEdMFgJUJXmkI7nUggGpVFUC1lx3PxClChVLhZWOuRB4WWqtcckZKQQbBtf7u2tnvzbg23xlN6571udUcClIJOK-Rfet0lnvHVT52plP7XY5wXkvN_-Tm_dy84PcDrraQwYAjoBSDItYsl-Hh3SX</recordid><startdate>20221101</startdate><enddate>20221101</enddate><creator>Jeong, Seungtaek</creator><creator>Kim, Tae-Wook</creator><creator>Lee, Seongsoo</creator><creator>Sim, Boogyo</creator><creator>Park, Hyunwook</creator><creator>Son, Kyungjune</creator><creator>Son, Keeyoung</creator><creator>Kim, Seongguk</creator><creator>Shin, Taein</creator><creator>Kim, Young-Cheon</creator><creator>Kim, Joungho</creator><creator>Kim, Byoung-Joon</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>F28</scope><scope>FR3</scope><scope>L7M</scope><orcidid>https://orcid.org/0000-0003-1040-4458</orcidid><orcidid>https://orcid.org/0000-0003-2720-7573</orcidid><orcidid>https://orcid.org/0000-0001-7003-5207</orcidid><orcidid>https://orcid.org/0000-0003-1376-0781</orcidid><orcidid>https://orcid.org/0000-0003-3019-3678</orcidid><orcidid>https://orcid.org/0000-0002-8925-2604</orcidid><orcidid>https://orcid.org/0000-0002-9944-9822</orcidid><orcidid>https://orcid.org/0000-0001-9356-3635</orcidid></search><sort><creationdate>20221101</creationdate><title>Analysis of Repetitive Bending on Flexible Wireless Power Transfer (WPT) PCB Coils for Flexible Wearable Devices</title><author>Jeong, Seungtaek ; Kim, Tae-Wook ; Lee, Seongsoo ; Sim, Boogyo ; Park, Hyunwook ; Son, Kyungjune ; Son, Keeyoung ; Kim, Seongguk ; Shin, Taein ; Kim, Young-Cheon ; Kim, Joungho ; Kim, Byoung-Joon</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c295t-8105438b7e9f854a48da73e1f9fce0a5a000199b968909a65770dcaaa0c531b73</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2022</creationdate><topic>Bend radius</topic><topic>Bending</topic><topic>Circuit boards</topic><topic>Coils</topic><topic>Diameters</topic><topic>Direct current</topic><topic>Flexible printed circuit board (FPCB) coils</topic><topic>Flexible printed circuits</topic><topic>flexible wearable device</topic><topic>Printed circuits</topic><topic>repetitive bending</topic><topic>Robustness</topic><topic>Substrates</topic><topic>Wearable computers</topic><topic>Wearable technology</topic><topic>Wireless power transfer</topic><topic>wireless power transfer (WPT)</topic><topic>Wireless power transmission</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Jeong, Seungtaek</creatorcontrib><creatorcontrib>Kim, Tae-Wook</creatorcontrib><creatorcontrib>Lee, Seongsoo</creatorcontrib><creatorcontrib>Sim, Boogyo</creatorcontrib><creatorcontrib>Park, Hyunwook</creatorcontrib><creatorcontrib>Son, Kyungjune</creatorcontrib><creatorcontrib>Son, Keeyoung</creatorcontrib><creatorcontrib>Kim, Seongguk</creatorcontrib><creatorcontrib>Shin, Taein</creatorcontrib><creatorcontrib>Kim, Young-Cheon</creatorcontrib><creatorcontrib>Kim, Joungho</creatorcontrib><creatorcontrib>Kim, Byoung-Joon</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Xplore</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>IEEE transactions on components, packaging, and manufacturing technology (2011)</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Jeong, Seungtaek</au><au>Kim, Tae-Wook</au><au>Lee, Seongsoo</au><au>Sim, Boogyo</au><au>Park, Hyunwook</au><au>Son, Kyungjune</au><au>Son, Keeyoung</au><au>Kim, Seongguk</au><au>Shin, Taein</au><au>Kim, Young-Cheon</au><au>Kim, Joungho</au><au>Kim, Byoung-Joon</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Analysis of Repetitive Bending on Flexible Wireless Power Transfer (WPT) PCB Coils for Flexible Wearable Devices</atitle><jtitle>IEEE transactions on components, packaging, and manufacturing technology (2011)</jtitle><stitle>TCPMT</stitle><date>2022-11-01</date><risdate>2022</risdate><volume>12</volume><issue>11</issue><spage>1748</spage><epage>1756</epage><pages>1748-1756</pages><issn>2156-3950</issn><eissn>2156-3985</eissn><coden>ITCPC8</coden><abstract>In this article, we first designed, measured, and analyzed flexible wireless power transfer (WPT) coils with repetitive bending cycles. To analyze any changes in electrical characteristics through repetitive bending cycles, <inline-formula> <tex-math notation="LaTeX">3\times3 </tex-math></inline-formula> cm flexible printed circuit board (PCB) coils were fabricated using polyimide substrates. Different coil configurations are designed to find a mechanically robust, flexible PCB coil design. First, we analyzed single-layer and double-layer coils. Generally, via is the mechanically weakest part of the PCB, hence the diameter of the via varies to observe the effect of repetitive bending cycle. Ten thousand bending cycles with a bending radius of 3 mm and a bending cycle frequency of 1 Hz were used to analyze the electrical changes. Moreover, the bending position of the coil is varied to observe the bending effect. The flexible coil's direct current (dc) resistance is measured during the bending cycle. After the repetitive bending test is completed, the coil impedance is analyzed in a frequency domain. As a result, we conclude that the flexible WPT coil is robust from mechanical stress when the layer of the coil is single a layer, the bending line is applied vertically, and the diameter of the via is small.</abstract><cop>Piscataway</cop><pub>IEEE</pub><doi>10.1109/TCPMT.2022.3217291</doi><tpages>9</tpages><orcidid>https://orcid.org/0000-0003-1040-4458</orcidid><orcidid>https://orcid.org/0000-0003-2720-7573</orcidid><orcidid>https://orcid.org/0000-0001-7003-5207</orcidid><orcidid>https://orcid.org/0000-0003-1376-0781</orcidid><orcidid>https://orcid.org/0000-0003-3019-3678</orcidid><orcidid>https://orcid.org/0000-0002-8925-2604</orcidid><orcidid>https://orcid.org/0000-0002-9944-9822</orcidid><orcidid>https://orcid.org/0000-0001-9356-3635</orcidid></addata></record> |
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| subjects | Bend radius Bending Circuit boards Coils Diameters Direct current Flexible printed circuit board (FPCB) coils Flexible printed circuits flexible wearable device Printed circuits repetitive bending Robustness Substrates Wearable computers Wearable technology Wireless power transfer wireless power transfer (WPT) Wireless power transmission |
| title | Analysis of Repetitive Bending on Flexible Wireless Power Transfer (WPT) PCB Coils for Flexible Wearable Devices |
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