A D-Band Magnetoelectric Dipole Antenna-in-Package (AiP) Implemented on BT-Based Organic Substrate

A high gain, wide bandwidth (BW), and low-profile D -band magnetoelectric dipole antenna-in-package (AiP) is proposed in this article. The unit antenna with a cavity backed slot is first evaluated by a substrate integrated waveguide (SIW) feed structure. The simulated impedance BW of the unit anten...

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Veröffentlicht in:IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2022-10, Vol.12 (10), p.1673-1680
Hauptverfasser: Kuo, Hung-Chun, Kuo, Chih-Wen, Wang, Chen-Chao, Hung, Chih-Pin
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container_title IEEE transactions on components, packaging, and manufacturing technology (2011)
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creator Kuo, Hung-Chun
Kuo, Chih-Wen
Wang, Chen-Chao
Hung, Chih-Pin
description A high gain, wide bandwidth (BW), and low-profile D -band magnetoelectric dipole antenna-in-package (AiP) is proposed in this article. The unit antenna with a cavity backed slot is first evaluated by a substrate integrated waveguide (SIW) feed structure. The simulated impedance BW of the unit antenna covers 27 GHz from 132 to 159 GHz with stable broadside radiation patterns. Then, a 4\times 2 array based on the proposed unit antenna is designed and verified on a four layer BT-based organic substrate. The array design is composed of an isolation, a 2\times 2 subarray, a two-way SIW power divider, and a probe pad to SIW transition. The 2\times 2 subarray is realized by a four-way broad wall coupler with a V-junction design in particular. Tested by probing on substrate in the direct far-field chamber, the measured impedance BW covers 23.4 GHz from 135.4 to 158.8 GHz with a peak gain of 14.1 dBi at 150 GHz. The average of measured gains within the 130-160-GHz band is 12 dBi. Modeled with the dimensions of structural analysis results from optical microscope (OM) and cross-sectional scanning electron microscope (SEM) inspection, the post-simulation result shows a good agreement with the measurement result, including impedance BW, radiation patterns, and gains. This article demonstrates that the proposed AiP using the low-cost BT-based substrate manufacturing technology can be a good candidate for the future D -band applications.
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The unit antenna with a cavity backed slot is first evaluated by a substrate integrated waveguide (SIW) feed structure. The simulated impedance BW of the unit antenna covers 27 GHz from 132 to 159 GHz with stable broadside radiation patterns. Then, a <inline-formula> <tex-math notation="LaTeX">4\times </tex-math></inline-formula> 2 array based on the proposed unit antenna is designed and verified on a four layer BT-based organic substrate. The array design is composed of an isolation, a <inline-formula> <tex-math notation="LaTeX">2\times </tex-math></inline-formula> 2 subarray, a two-way SIW power divider, and a probe pad to SIW transition. The <inline-formula> <tex-math notation="LaTeX">2\times </tex-math></inline-formula> 2 subarray is realized by a four-way broad wall coupler with a V-junction design in particular. Tested by probing on substrate in the direct far-field chamber, the measured impedance BW covers 23.4 GHz from 135.4 to 158.8 GHz with a peak gain of 14.1 dBi at 150 GHz. The average of measured gains within the 130-160-GHz band is 12 dBi. Modeled with the dimensions of structural analysis results from optical microscope (OM) and cross-sectional scanning electron microscope (SEM) inspection, the post-simulation result shows a good agreement with the measurement result, including impedance BW, radiation patterns, and gains. This article demonstrates that the proposed AiP using the low-cost BT-based substrate manufacturing technology can be a good candidate for the future <inline-formula> <tex-math notation="LaTeX">D </tex-math></inline-formula>-band applications.]]></abstract><cop>Piscataway</cop><pub>IEEE</pub><doi>10.1109/TCPMT.2022.3211500</doi><tpages>8</tpages><orcidid>https://orcid.org/0000-0001-9023-3999</orcidid><orcidid>https://orcid.org/0000-0002-7690-6656</orcidid><orcidid>https://orcid.org/0000-0003-3899-6176</orcidid><orcidid>https://orcid.org/0000-0003-1707-7138</orcidid></addata></record>
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source IEEE Electronic Library (IEL)
subjects Antenna array
Antenna arrays
Antenna feeds
antenna-in-package (AiP)
Antennas
Bandwidth
D-band
Dipole antennas
Far fields
High gain
Impedance
Inspection
magnetoelectric (ME) dipole
Manufacturing
Optical microscopes
power divider (PD)
Power dividers
Radiation
Slot antennas
Structural analysis
substrate integrated waveguide (SIW)
Substrate integrated waveguides
Substrates
title A D-Band Magnetoelectric Dipole Antenna-in-Package (AiP) Implemented on BT-Based Organic Substrate
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