Contacting Inkjet-Printed Silver Structures and SMD by ICA and Solder
Digitally printed conductive structures often need to be electrically connected to batteries, microcontrollers, or other devices. A consensus of industry and research is that such hybrid printed electronics will play a major part in the future of printed electronics. To promote the technology of hyb...
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| Veröffentlicht in: | IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2022-07, Vol.12 (7), p.1232-1240 |
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| container_title | IEEE transactions on components, packaging, and manufacturing technology (2011) |
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| creator | Jager, Jonas Buschkamp, Sascha Werum, Kai Glaser, Kerstin Grozinger, Tobias Eberhardt, Wolfgang Zimmermann, Andre |
| description | Digitally printed conductive structures often need to be electrically connected to batteries, microcontrollers, or other devices. A consensus of industry and research is that such hybrid printed electronics will play a major part in the future of printed electronics. To promote the technology of hybrid printed electronics, surface mount technologies for electronic components using isotropic conductive adhesives (ICAs) and low melting tin bismuth solders on inkjet-printed silver structures on injection molded liquid crystal polymer (LCP) substrates were investigated in this publication. The special needs for inkjet-printed electronics were considered as well as the reliability of assembled surface mounted devices (SMDs) and their failure mechanisms. Connected 0603 and 1206 SMD components achieved a characteristic fatigue life of more than 3500 cycles during thermal cycling at +125 °C/−40 °C and withstood over 1000 h under a damp-heat atmosphere of +85 °C/85% RH. The coefficient of thermal expansion (CTE) of the substrate and the selection of solder have major impacts on the reliability of the assemblies. |
| doi_str_mv | 10.1109/TCPMT.2022.3169558 |
| format | Article |
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A consensus of industry and research is that such hybrid printed electronics will play a major part in the future of printed electronics. To promote the technology of hybrid printed electronics, surface mount technologies for electronic components using isotropic conductive adhesives (ICAs) and low melting tin bismuth solders on inkjet-printed silver structures on injection molded liquid crystal polymer (LCP) substrates were investigated in this publication. The special needs for inkjet-printed electronics were considered as well as the reliability of assembled surface mounted devices (SMDs) and their failure mechanisms. Connected 0603 and 1206 SMD components achieved a characteristic fatigue life of more than 3500 cycles during thermal cycling at +125 °C/−40 °C and withstood over 1000 h under a damp-heat atmosphere of +85 °C/85% RH. 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A consensus of industry and research is that such hybrid printed electronics will play a major part in the future of printed electronics. To promote the technology of hybrid printed electronics, surface mount technologies for electronic components using isotropic conductive adhesives (ICAs) and low melting tin bismuth solders on inkjet-printed silver structures on injection molded liquid crystal polymer (LCP) substrates were investigated in this publication. The special needs for inkjet-printed electronics were considered as well as the reliability of assembled surface mounted devices (SMDs) and their failure mechanisms. Connected 0603 and 1206 SMD components achieved a characteristic fatigue life of more than 3500 cycles during thermal cycling at +125 °C/−40 °C and withstood over 1000 h under a damp-heat atmosphere of +85 °C/85% RH. The coefficient of thermal expansion (CTE) of the substrate and the selection of solder have major impacts on the reliability of the assemblies.</description><subject>Bismuth</subject><subject>Crystal structure</subject><subject>Electronic components</subject><subject>Electronics</subject><subject>Failure mechanisms</subject><subject>Fatigue life</subject><subject>Ink jet printing</subject><subject>Inkjet printing</subject><subject>Liquid crystal polymers</subject><subject>Liquid crystals</subject><subject>Manufacturing</subject><subject>Microcontrollers</subject><subject>Printing</subject><subject>Reliability</subject><subject>Resistors</subject><subject>Silver</subject><subject>Soldering</subject><subject>Solders</subject><subject>Substrates</subject><subject>surface mounting</subject><subject>Surface-mounted devices</subject><subject>Temperature measurement</subject><subject>Thermal cycling</subject><subject>Thermal expansion</subject><issn>2156-3950</issn><issn>2156-3985</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2022</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNo9kE1PwzAMhiMEEtPYH4BLJc4dcT6a5ojKgEmbmLRxjtLUQx2jHWmKtH9PoNNycWy_ry0_hNwCnQJQ_bApVsvNlFHGphwyLWV-QUYMZJZyncvL81_SazLpuh2NT-ZUUT4is6JtgnWhbj6SefO5w5CufN0ErJJ1vf9Bn6yD713oPXaJbWJ1-ZSUx2RePA5pu6_Q35Crrd13ODnFMXl_nm2K13Tx9hKVi9QxLUPKJepcMwAnpcZMobVZJiQIAaws-dZirqkVlAtHZelYVVoWm5USVlagNB-T-2HuwbffPXbB7NreN3GlYfFwkFyAiio2qJxvu87j1hx8_WX90QA1f8TMPzHzR8yciEXT3WCqEfFs0CoDzRT_BSQXZPA</recordid><startdate>20220701</startdate><enddate>20220701</enddate><creator>Jager, Jonas</creator><creator>Buschkamp, Sascha</creator><creator>Werum, Kai</creator><creator>Glaser, Kerstin</creator><creator>Grozinger, Tobias</creator><creator>Eberhardt, Wolfgang</creator><creator>Zimmermann, Andre</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. 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| source | IEEE Electronic Library (IEL) |
| subjects | Bismuth Crystal structure Electronic components Electronics Failure mechanisms Fatigue life Ink jet printing Inkjet printing Liquid crystal polymers Liquid crystals Manufacturing Microcontrollers Printing Reliability Resistors Silver Soldering Solders Substrates surface mounting Surface-mounted devices Temperature measurement Thermal cycling Thermal expansion |
| title | Contacting Inkjet-Printed Silver Structures and SMD by ICA and Solder |
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