Wafer-Level AuSn/Pt Solid-Liquid Interdiffusion Bonding

In this paper, wafer-level AuSn/Pt solid-liquid interdiffusion bonding for hermetic encapsulation of microelectromechanical systems (MEMS) is evaluated. Although AuSn is used for bonding of ICs, the implementation of AuSn diffusion bonding in MEMS applications requires thorough understanding of its...

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Veröffentlicht in:	IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2018-02, Vol.8 (2), p.169-176
Hauptverfasser:	Rautiainen, Antti, Vuorinen, Vesa, Heikkinen, Hannele, Paulasto-Krockel, Mervi
Format:	Artikel
Sprache:	eng
Schlagworte:	Adhesive bonding Au–Sn–Pt system Bond strength Bonding Bonding strength Buffer layers CMOS Encapsulation Gold Interdiffusion intermetallic compounds (IMCs) Level (quantity) Metallization Metallizing Microelectromechanical systems Micromechanical devices Molybdenum Platinum remelting temperature Shear strength Shock tests solid–liquid interdiffusion (SLID) bonding Systems analysis Tensile strength Tensile tests Thermal shock Thickness Tin
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