Parasitic Extraction for Heterogeneous Face-to-Face Bonded 3-D ICs

Face-to-face (F2F)-bonded 3-D ICs provide higher vertical interconnection densities and cost-effective solutions compared to face-to-back-bonded 3-D ICs. With a bumpless direct-copper-bonding process, the die-to-die distance is significantly reduced to enable a finer F2F via pitch. Unfortunately, th...

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Veröffentlicht in:	IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2017-06, Vol.7 (6), p.912-924
Hauptverfasser:	Yarui Peng, Taigon Song, Petranovic, Dusan, Sung Kyu Lim
Format:	Artikel
Sprache:	eng
Schlagworte:	3-D IC Bonding CAD Capacitance capacitance extraction Complexity Computer aided design Copper Coupling Couplings Device-to-device communication die-by-die Dies Errors Extraction face-to-face (F2F) Foundries heterogeneous integration holistic in-context Integrated circuits Intellectual property Metals Technology utilization Tradeoffs
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