Materials Characteristics of Ag-Alloy Wires and Their Applications in Advanced Packages
The materials characteristics of annealing-twinned Ag-alloy wires with various Au and Pd contents were evaluated in this paper. The results indicated that both Ag-8Au-3Pd and Ag-15Au-3Pd have higher strength and corrosion resistance than do pure Ag and binary Ag-Pd wires. On the other hand, the pure...
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| Veröffentlicht in: | IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2016-02, Vol.6 (2), p.298-305 |
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| creator | Chih-Hsin Tsai Chien-Hsun Chuang Hsing-Hua Tsai Jun-Der Lee Chang, Dennis Hsin-Jung Lin Tung-Han Chuang |
| description | The materials characteristics of annealing-twinned Ag-alloy wires with various Au and Pd contents were evaluated in this paper. The results indicated that both Ag-8Au-3Pd and Ag-15Au-3Pd have higher strength and corrosion resistance than do pure Ag and binary Ag-Pd wires. On the other hand, the pure Ag, Ag-0.5Pd, Ag-3Pd, and Ag-4Pd wires possess the merits of lower material cost, higher electrical conductivity, and higher electromigration durability than do the ternary Ag-Au-Pd wires. However, the breaking load and elongation of pure Ag wire are inferior to those of Ag-0.5Pd, Ag-3Pd, and Ag-4Pd wires. In addition, the corrosion resistances of pure Ag and Ag-0.5Pd wires are far inferior to those of Ag-3Pd and Ag-4Pd wires. Based on these performances, the ternary Ag-8Au-3Pd wire is an ideal substitute for the traditional Au wire due to its high strength, corrosion resistance, and reliability, while the Ag-3Pd and Ag-4Pd are cost-friendly bonding wires for high-frequency integrated circuit devices. |
| doi_str_mv | 10.1109/TCPMT.2015.2453410 |
| format | Article |
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The results indicated that both Ag-8Au-3Pd and Ag-15Au-3Pd have higher strength and corrosion resistance than do pure Ag and binary Ag-Pd wires. On the other hand, the pure Ag, Ag-0.5Pd, Ag-3Pd, and Ag-4Pd wires possess the merits of lower material cost, higher electrical conductivity, and higher electromigration durability than do the ternary Ag-Au-Pd wires. However, the breaking load and elongation of pure Ag wire are inferior to those of Ag-0.5Pd, Ag-3Pd, and Ag-4Pd wires. In addition, the corrosion resistances of pure Ag and Ag-0.5Pd wires are far inferior to those of Ag-3Pd and Ag-4Pd wires. Based on these performances, the ternary Ag-8Au-3Pd wire is an ideal substitute for the traditional Au wire due to its high strength, corrosion resistance, and reliability, while the Ag-3Pd and Ag-4Pd are cost-friendly bonding wires for high-frequency integrated circuit devices.</description><identifier>ISSN: 2156-3950</identifier><identifier>EISSN: 2156-3985</identifier><identifier>DOI: 10.1109/TCPMT.2015.2453410</identifier><identifier>CODEN: ITCPC8</identifier><language>eng</language><publisher>Piscataway: IEEE</publisher><subject>Alloys ; Annealing ; Annealing twins ; binary Ag-Pd wires ; Bonding ; Corrosion ; Corrosion resistance ; Devices ; Durability ; Electric wire ; Elongation ; Gold ; Palladium ; Silver ; Silver base alloys ; ternary Ag-Au-Pd wires ; Wire ; wire bonding ; Wires</subject><ispartof>IEEE transactions on components, packaging, and manufacturing technology (2011), 2016-02, Vol.6 (2), p.298-305</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2016</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c377t-caec617d6e72fd93f7953c221dc56b207d0a05784e86ddc98e5c70276ee305d23</citedby><cites>FETCH-LOGICAL-c377t-caec617d6e72fd93f7953c221dc56b207d0a05784e86ddc98e5c70276ee305d23</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/7384455$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,776,780,792,27903,27904,54736</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/7384455$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Chih-Hsin Tsai</creatorcontrib><creatorcontrib>Chien-Hsun Chuang</creatorcontrib><creatorcontrib>Hsing-Hua Tsai</creatorcontrib><creatorcontrib>Jun-Der Lee</creatorcontrib><creatorcontrib>Chang, Dennis</creatorcontrib><creatorcontrib>Hsin-Jung Lin</creatorcontrib><creatorcontrib>Tung-Han Chuang</creatorcontrib><title>Materials Characteristics of Ag-Alloy Wires and Their Applications in Advanced Packages</title><title>IEEE transactions on components, packaging, and manufacturing technology (2011)</title><addtitle>TCPMT</addtitle><description>The materials characteristics of annealing-twinned Ag-alloy wires with various Au and Pd contents were evaluated in this paper. The results indicated that both Ag-8Au-3Pd and Ag-15Au-3Pd have higher strength and corrosion resistance than do pure Ag and binary Ag-Pd wires. On the other hand, the pure Ag, Ag-0.5Pd, Ag-3Pd, and Ag-4Pd wires possess the merits of lower material cost, higher electrical conductivity, and higher electromigration durability than do the ternary Ag-Au-Pd wires. However, the breaking load and elongation of pure Ag wire are inferior to those of Ag-0.5Pd, Ag-3Pd, and Ag-4Pd wires. In addition, the corrosion resistances of pure Ag and Ag-0.5Pd wires are far inferior to those of Ag-3Pd and Ag-4Pd wires. Based on these performances, the ternary Ag-8Au-3Pd wire is an ideal substitute for the traditional Au wire due to its high strength, corrosion resistance, and reliability, while the Ag-3Pd and Ag-4Pd are cost-friendly bonding wires for high-frequency integrated circuit devices.</description><subject>Alloys</subject><subject>Annealing</subject><subject>Annealing twins</subject><subject>binary Ag-Pd wires</subject><subject>Bonding</subject><subject>Corrosion</subject><subject>Corrosion resistance</subject><subject>Devices</subject><subject>Durability</subject><subject>Electric wire</subject><subject>Elongation</subject><subject>Gold</subject><subject>Palladium</subject><subject>Silver</subject><subject>Silver base alloys</subject><subject>ternary Ag-Au-Pd wires</subject><subject>Wire</subject><subject>wire bonding</subject><subject>Wires</subject><issn>2156-3950</issn><issn>2156-3985</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2016</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNpdkD1rwzAQhk1poSHNH2gXQZcuTvVhWfJoTL8goRlcMgpVOidKHTuVnEL-fe0mZOgtdwfPexxPFN0SPCUEZ49lsZiXU4oJn9KEs4Tgi2hECU9jlkl-eZ45vo4mIWxwX1xigdkoWs51B97pOqBirb02wxY6ZwJqK5Sv4ryu2wNaOg8B6caicg3Oo3y3q53RnWubgFyDcvujGwMWLbT50isIN9FV1R-FyamPo4_np7J4jWfvL29FPosNE6KLjQaTEmFTELSyGatExpmhlFjD00-KhcUacyETkKm1JpPAjcBUpAAMc0vZOHo43t359nsPoVNbFwzUtW6g3QdFJEmxxIwlPXr_D920e9_03ykipOglcTFQ9EgZ34bgoVI777baHxTBatCt_nSrQbc66e5Dd8eQA4BzQDCZJJyzX8fBenE</recordid><startdate>201602</startdate><enddate>201602</enddate><creator>Chih-Hsin Tsai</creator><creator>Chien-Hsun Chuang</creator><creator>Hsing-Hua Tsai</creator><creator>Jun-Der Lee</creator><creator>Chang, Dennis</creator><creator>Hsin-Jung Lin</creator><creator>Tung-Han Chuang</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>F28</scope><scope>FR3</scope><scope>L7M</scope><scope>7SE</scope><scope>8BQ</scope><scope>JG9</scope></search><sort><creationdate>201602</creationdate><title>Materials Characteristics of Ag-Alloy Wires and Their Applications in Advanced Packages</title><author>Chih-Hsin Tsai ; Chien-Hsun Chuang ; Hsing-Hua Tsai ; Jun-Der Lee ; Chang, Dennis ; Hsin-Jung Lin ; Tung-Han Chuang</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c377t-caec617d6e72fd93f7953c221dc56b207d0a05784e86ddc98e5c70276ee305d23</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2016</creationdate><topic>Alloys</topic><topic>Annealing</topic><topic>Annealing twins</topic><topic>binary Ag-Pd wires</topic><topic>Bonding</topic><topic>Corrosion</topic><topic>Corrosion resistance</topic><topic>Devices</topic><topic>Durability</topic><topic>Electric wire</topic><topic>Elongation</topic><topic>Gold</topic><topic>Palladium</topic><topic>Silver</topic><topic>Silver base alloys</topic><topic>ternary Ag-Au-Pd wires</topic><topic>Wire</topic><topic>wire bonding</topic><topic>Wires</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Chih-Hsin Tsai</creatorcontrib><creatorcontrib>Chien-Hsun Chuang</creatorcontrib><creatorcontrib>Hsing-Hua Tsai</creatorcontrib><creatorcontrib>Jun-Der Lee</creatorcontrib><creatorcontrib>Chang, Dennis</creatorcontrib><creatorcontrib>Hsin-Jung Lin</creatorcontrib><creatorcontrib>Tung-Han Chuang</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Corrosion Abstracts</collection><collection>METADEX</collection><collection>Materials Research Database</collection><jtitle>IEEE transactions on components, packaging, and manufacturing technology (2011)</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Chih-Hsin Tsai</au><au>Chien-Hsun Chuang</au><au>Hsing-Hua Tsai</au><au>Jun-Der Lee</au><au>Chang, Dennis</au><au>Hsin-Jung Lin</au><au>Tung-Han Chuang</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Materials Characteristics of Ag-Alloy Wires and Their Applications in Advanced Packages</atitle><jtitle>IEEE transactions on components, packaging, and manufacturing technology (2011)</jtitle><stitle>TCPMT</stitle><date>2016-02</date><risdate>2016</risdate><volume>6</volume><issue>2</issue><spage>298</spage><epage>305</epage><pages>298-305</pages><issn>2156-3950</issn><eissn>2156-3985</eissn><coden>ITCPC8</coden><abstract>The materials characteristics of annealing-twinned Ag-alloy wires with various Au and Pd contents were evaluated in this paper. The results indicated that both Ag-8Au-3Pd and Ag-15Au-3Pd have higher strength and corrosion resistance than do pure Ag and binary Ag-Pd wires. On the other hand, the pure Ag, Ag-0.5Pd, Ag-3Pd, and Ag-4Pd wires possess the merits of lower material cost, higher electrical conductivity, and higher electromigration durability than do the ternary Ag-Au-Pd wires. However, the breaking load and elongation of pure Ag wire are inferior to those of Ag-0.5Pd, Ag-3Pd, and Ag-4Pd wires. In addition, the corrosion resistances of pure Ag and Ag-0.5Pd wires are far inferior to those of Ag-3Pd and Ag-4Pd wires. Based on these performances, the ternary Ag-8Au-3Pd wire is an ideal substitute for the traditional Au wire due to its high strength, corrosion resistance, and reliability, while the Ag-3Pd and Ag-4Pd are cost-friendly bonding wires for high-frequency integrated circuit devices.</abstract><cop>Piscataway</cop><pub>IEEE</pub><doi>10.1109/TCPMT.2015.2453410</doi><tpages>8</tpages></addata></record> |
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| subjects | Alloys Annealing Annealing twins binary Ag-Pd wires Bonding Corrosion Corrosion resistance Devices Durability Electric wire Elongation Gold Palladium Silver Silver base alloys ternary Ag-Au-Pd wires Wire wire bonding Wires |
| title | Materials Characteristics of Ag-Alloy Wires and Their Applications in Advanced Packages |
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