Development of Package-on-Package Using Embedded Wafer-Level Package Approach

The ever-increasing demands of higher performance, multiple functions, higher density, and lower cost mandate the reduction of the I/O pitch on the die as well as on the package. Pitch specifications of current substrate technologies do not match the stringent fine-pitch I/O requirements. Combining...

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Veröffentlicht in:	IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2013-10, Vol.3 (10), p.1654-1662
Hauptverfasser:	Ser Choongv Chong, Wee, David Ho Soon, Rao, Vempati Srinivasa, Vasarla, Nagendra Sekhar
Format:	Artikel
Sprache:	eng
Schlagworte:	Electronic packaging thermal management Embedded wafer-level package (EMWLP) finite element analysis Heating package on package (Pop) Silicon solder joint reliability Solids Stress Studies Substrates thermal analysis Thermal cycling through-mold via (TMV)
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