Evaluation of Lead-Free Solder Bump Voiding Ball Grid Array Packages Using Laser Ultrasound and Interferometric Technique

Solder joint voids are usually formed by the entrapped gas bubbles during the reflow process and are common in all surface mount applications. It is a controversial issue on the reliability of the solder joint; however, the consensus is that voiding is only acceptable at low contents, whereas excess...

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Veröffentlicht in:	IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2013-08, Vol.3 (8), p.1310-1320
Hauptverfasser:	Ume, Ifeanyi Charles, Jie Gong
Format:	Artikel
Sprache:	eng
Schlagworte:	Acoustics Electronic packaging Inspection laser ultrasound Lead Measurement by laser beam scanning acoustic microscope solder bump void Soldering Ultrasonic imaging void evaluation X-Ray X-ray imaging
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