Influence of Tin Deposition Methods on Tin Whisker Formation
The effect of pure tin deposition method on the propensity to form tin whiskers was studied over the course of one year. Deposition methods employed include matte and bright electroplating, electroless plating, sputtering, and evaporation (crucible resistive and electron beam). Films produced under...
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| Veröffentlicht in: | IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2011-12, Vol.1 (12), p.2028-2032 |
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| container_title | IEEE transactions on components, packaging, and manufacturing technology (2011) |
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| creator | Pinol, L. A. Melngailis, J. Charles, H. K. Lee, D. M. Deacon, R. Coles, G. Clatterbaugh, G. |
| description | The effect of pure tin deposition method on the propensity to form tin whiskers was studied over the course of one year. Deposition methods employed include matte and bright electroplating, electroless plating, sputtering, and evaporation (crucible resistive and electron beam). Films produced under high vacuum, via electron beam evaporation or DC sputtering, were found to whisker immediately, while matte electroplated and electroless plated films took 9 weeks to form whiskers. Films formed by resistive evaporation and bright electroplating displayed no whisker starts after more than a year of ambient aging. Film thickness and average grain size were not found to impact whisker propensity. |
| doi_str_mv | 10.1109/TCPMT.2011.2167338 |
| format | Article |
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A. ; Melngailis, J. ; Charles, H. K. ; Lee, D. M. ; Deacon, R. ; Coles, G. ; Clatterbaugh, G.</creator><creatorcontrib>Pinol, L. A. ; Melngailis, J. ; Charles, H. K. ; Lee, D. M. ; Deacon, R. ; Coles, G. ; Clatterbaugh, G.</creatorcontrib><description>The effect of pure tin deposition method on the propensity to form tin whiskers was studied over the course of one year. Deposition methods employed include matte and bright electroplating, electroless plating, sputtering, and evaporation (crucible resistive and electron beam). Films produced under high vacuum, via electron beam evaporation or DC sputtering, were found to whisker immediately, while matte electroplated and electroless plated films took 9 weeks to form whiskers. Films formed by resistive evaporation and bright electroplating displayed no whisker starts after more than a year of ambient aging. Film thickness and average grain size were not found to impact whisker propensity.</description><identifier>ISSN: 2156-3950</identifier><identifier>EISSN: 2156-3985</identifier><identifier>DOI: 10.1109/TCPMT.2011.2167338</identifier><identifier>CODEN: ITCPC8</identifier><language>eng</language><publisher>Piscataway, NJ: IEEE</publisher><subject>Applied sciences ; Cross-disciplinary physics: materials science; rheology ; Deposition by sputtering ; Educational institutions ; Electrodeposition, electroplating ; Electron beams ; Electronics ; Exact sciences and technology ; Laboratories ; Lead ; Lead free ; Materials science ; Methods of deposition of films and coatings; film growth and epitaxy ; Microelectronic fabrication (materials and surfaces technology) ; microelectronics reliability ; physical vapor deposition ; Physics ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; Sputtering ; thin films ; Tin ; tin whiskering</subject><ispartof>IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-12, Vol.1 (12), p.2028-2032</ispartof><rights>2015 INIST-CNRS</rights><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) Dec 2011</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c325t-a9a68208e0ee1a73cf15650a5959598d037918afc7b67882cd6956605ed9ec183</citedby><cites>FETCH-LOGICAL-c325t-a9a68208e0ee1a73cf15650a5959598d037918afc7b67882cd6956605ed9ec183</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/6119122$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,780,784,796,27924,27925,54758</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/6119122$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=25440454$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Pinol, L. A.</creatorcontrib><creatorcontrib>Melngailis, J.</creatorcontrib><creatorcontrib>Charles, H. K.</creatorcontrib><creatorcontrib>Lee, D. M.</creatorcontrib><creatorcontrib>Deacon, R.</creatorcontrib><creatorcontrib>Coles, G.</creatorcontrib><creatorcontrib>Clatterbaugh, G.</creatorcontrib><title>Influence of Tin Deposition Methods on Tin Whisker Formation</title><title>IEEE transactions on components, packaging, and manufacturing technology (2011)</title><addtitle>TCPMT</addtitle><description>The effect of pure tin deposition method on the propensity to form tin whiskers was studied over the course of one year. Deposition methods employed include matte and bright electroplating, electroless plating, sputtering, and evaporation (crucible resistive and electron beam). Films produced under high vacuum, via electron beam evaporation or DC sputtering, were found to whisker immediately, while matte electroplated and electroless plated films took 9 weeks to form whiskers. Films formed by resistive evaporation and bright electroplating displayed no whisker starts after more than a year of ambient aging. Film thickness and average grain size were not found to impact whisker propensity.</description><subject>Applied sciences</subject><subject>Cross-disciplinary physics: materials science; rheology</subject><subject>Deposition by sputtering</subject><subject>Educational institutions</subject><subject>Electrodeposition, electroplating</subject><subject>Electron beams</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Laboratories</subject><subject>Lead</subject><subject>Lead free</subject><subject>Materials science</subject><subject>Methods of deposition of films and coatings; film growth and epitaxy</subject><subject>Microelectronic fabrication (materials and surfaces technology)</subject><subject>microelectronics reliability</subject><subject>physical vapor deposition</subject><subject>Physics</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>Sputtering</subject><subject>thin films</subject><subject>Tin</subject><subject>tin whiskering</subject><issn>2156-3950</issn><issn>2156-3985</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2011</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNo9kMFOwzAMhiMEEtPYC8ClEuLYESdNmkhc0GAwaRMcijhWIXW1jq0ZSXfg7UlZNftgS_782_oJuQY6BaD6vpi9r4opowBTBjLnXJ2REQMhU66VOD_1gl6SSQgbGkMomlM-Ig-Ltt4esLWYuDopmjZ5wr0LTde4Nllht3ZVSGLbTz7XTfhGn8yd35keuCIXtdkGnAx1TD7mz8XsNV2-vSxmj8vUcia61GgjFaMKKSKYnNs6_iOoEbpPVVGea1CmtvmXzJVitpJaSEkFVhotKD4mt0fdvXc_BwxduXEH38aTJVCgAgAEjxQ7Uta7EDzW5d43O-N_I1T2RpX_RpW9UeVgVFy6G6RNsGZbe9PaJpw2mcgymokscjdHrkHE01gCaGCM_wH12W7U</recordid><startdate>20111201</startdate><enddate>20111201</enddate><creator>Pinol, L. A.</creator><creator>Melngailis, J.</creator><creator>Charles, H. K.</creator><creator>Lee, D. 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A.</au><au>Melngailis, J.</au><au>Charles, H. K.</au><au>Lee, D. M.</au><au>Deacon, R.</au><au>Coles, G.</au><au>Clatterbaugh, G.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Influence of Tin Deposition Methods on Tin Whisker Formation</atitle><jtitle>IEEE transactions on components, packaging, and manufacturing technology (2011)</jtitle><stitle>TCPMT</stitle><date>2011-12-01</date><risdate>2011</risdate><volume>1</volume><issue>12</issue><spage>2028</spage><epage>2032</epage><pages>2028-2032</pages><issn>2156-3950</issn><eissn>2156-3985</eissn><coden>ITCPC8</coden><abstract>The effect of pure tin deposition method on the propensity to form tin whiskers was studied over the course of one year. Deposition methods employed include matte and bright electroplating, electroless plating, sputtering, and evaporation (crucible resistive and electron beam). 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| source | IEEE Electronic Library (IEL) |
| subjects | Applied sciences Cross-disciplinary physics: materials science rheology Deposition by sputtering Educational institutions Electrodeposition, electroplating Electron beams Electronics Exact sciences and technology Laboratories Lead Lead free Materials science Methods of deposition of films and coatings film growth and epitaxy Microelectronic fabrication (materials and surfaces technology) microelectronics reliability physical vapor deposition Physics Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Sputtering thin films Tin tin whiskering |
| title | Influence of Tin Deposition Methods on Tin Whisker Formation |
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