Adhesion and Evaluation of Thermoplastic Nonconductive Film Materials in Flip Chip for Fine-Pitch Chip-on-Flex

In this paper, flip-chip interconnections were made on very flexible polyethylene naphthalate substrates using nonconductive films (NCFs). In general, the NCF/underfill materials are both epoxy thermosetting substances, and it was found that the curing process would increase the internal stress, shr...

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Veröffentlicht in:	IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2011-07, Vol.1 (7), p.984-990
Hauptverfasser:	HSIEH, Chin-Tang, LIAO, Kun-Hou, CHEN, Guo-Ju, LEE, Chen-Mu, LIN, Hung-Jan, CHENG, Kai-Jen
Format:	Artikel
Sprache:	eng
Schlagworte:	Apples Applied sciences Bonding Chip-on-film Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology fine-pitch application Gold inner lead bonding Integrated circuits Lead Reliability Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Substrates thermoplastic Tin workability
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