Resolution of the Gold Wire Grain Growth Failure Mechanism in Plastic Encapsulated Microelectronic Devices

The relative statistical influence of bonding parameters and assembly materials on the failure frequency rate of microelectronic devices in plastic encapsulated packages due to grain growth, "wire creep" failure are resolved. Wire creep is a stressinduced break in a thermocompression gold...

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Veröffentlicht in:	IEEE transactions on components, hybrids, and manufacturing technology hybrids, and manufacturing technology, 1980-09, Vol.3 (3), p.370-374
1. Verfasser:	James, H.
Format:	Artikel
Sprache:	eng
Schlagworte:	Bonding Creep Electric shock Failure analysis Frequency Gold Impurities Microelectronics Plastics Wire
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