Thick-film Technology: An Introduction to the Materials

The use of thick-film technology to manufacture electronic circuits and discrete passive components continues to grow at a rapid rate worldwide. When applied to hybrid microcircuits, it can be viewed as a means of packaging active devices, spanning the gap between monolithic integrated circuit chips...

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Veröffentlicht in:	IEEE transactions on components, hybrids, and manufacturing technology hybrids, and manufacturing technology, 1980-06, Vol.3 (2), p.211-225
Hauptverfasser:	Larry, J., Rosenberg, R., Uhler, R.
Format:	Artikel
Sprache:	eng
Schlagworte:	and manufacturing technology Components Conducting materials Dielectric materials Electronic circuits Electronics packaging Hybrid integrated circuits Integrated circuit packaging Integrated circuit technology Monolithic integrated circuits packaging Printed circuits
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