Thick-film Technology: An Introduction to the Materials
The use of thick-film technology to manufacture electronic circuits and discrete passive components continues to grow at a rapid rate worldwide. When applied to hybrid microcircuits, it can be viewed as a means of packaging active devices, spanning the gap between monolithic integrated circuit chips...
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| Veröffentlicht in: | IEEE transactions on components, hybrids, and manufacturing technology hybrids, and manufacturing technology, 1980-06, Vol.3 (2), p.211-225 |
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| container_end_page | 225 |
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| container_issue | 2 |
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| container_title | IEEE transactions on components, hybrids, and manufacturing technology |
| container_volume | 3 |
| creator | Larry, J. Rosenberg, R. Uhler, R. |
| description | The use of thick-film technology to manufacture electronic circuits and discrete passive components continues to grow at a rapid rate worldwide. When applied to hybrid microcircuits, it can be viewed as a means of packaging active devices, spanning the gap between monolithic integrated circuit chips and printed circuit boards with attached active and passive components. The strength of the thick-film approach is a consequence of function, size, and unit cost trade-offs; advances in materials have played a major role relative to each of these factors. Thick-film materials are developed to meet needs defined by electronic circuit design and process engineers. A general understanding of thick films is provided from a materials standpoint, particularly for the new engineer. Background is developed for a basic, yet simple, understanding of the components that make up resistor, conductor, and dielectric compositions, of processing, and of the properties of the final thick-film composite structures. |
| doi_str_mv | 10.1109/TCHMT.1980.1135609 |
| format | Article |
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| identifier | ISSN: 0148-6411 |
| ispartof | IEEE transactions on components, hybrids, and manufacturing technology, 1980-06, Vol.3 (2), p.211-225 |
| issn | 0148-6411 1558-3082 |
| language | eng |
| recordid | cdi_crossref_primary_10_1109_TCHMT_1980_1135609 |
| source | IEEE Electronic Library (IEL) |
| subjects | and manufacturing technology Components Conducting materials Dielectric materials Electronic circuits Electronics packaging Hybrid integrated circuits Integrated circuit packaging Integrated circuit technology Monolithic integrated circuits packaging Printed circuits |
| title | Thick-film Technology: An Introduction to the Materials |
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