Experimental/Numerical Analysis of Thermally Induced Warpage of Ultrathin Chip-on-Flex (UTCOF) Interconnects

Future applications of flexible displays and wearable electronics will need 3-D stacked flexible interconnects. The interconnection of an ultrathin chip-on-flex (UTCOF) that can provide flexibility is one approach that meets this requirement. Therefore, thermally induced warpage of UTCOF interconnec...

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Veröffentlicht in:	IEEE transactions on components and packaging technologies 2010-12, Vol.33 (4), p.819-829
Hauptverfasser:	Lu, Su-Tsai, Chen, Wen-Hwa
Format:	Artikel
Sprache:	eng
Schlagworte:	Adhesive bonding Anisotropic conductive adhesive (ACA) Bonding processes C (programming language) Chips Conductive adhesives finite element (FE) analysis Finite element method Finite element methods Flexible electronics Gold reliability Scanning electron microscopy Silicon substrates Studies Substrates Temperature Temperature measurement Thermal analysis thermally induced warpage ultrathin chip-on-flex (UTCOF) Warpage
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