Inductance and Resistance Calculations in Three-Dimensional Packaging Using Cylindrical Conduction-Mode Basis Functions

For the successful electrical design of system-in-package, this paper proposes an efficient method for extracting wideband resistance and inductance from a large number of 3-D interconnections. The proposed method uses the modal equivalent network from the electric field integral equation with cylin...

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Veröffentlicht in:IEEE transactions on computer-aided design of integrated circuits and systems 2009-06, Vol.28 (6), p.846-859
Hauptverfasser: Ki Jin Han, Swaminathan, M.
Format: Artikel
Sprache:eng
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