Inductance and Resistance Calculations in Three-Dimensional Packaging Using Cylindrical Conduction-Mode Basis Functions
For the successful electrical design of system-in-package, this paper proposes an efficient method for extracting wideband resistance and inductance from a large number of 3-D interconnections. The proposed method uses the modal equivalent network from the electric field integral equation with cylin...
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Veröffentlicht in: | IEEE transactions on computer-aided design of integrated circuits and systems 2009-06, Vol.28 (6), p.846-859 |
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Sprache: | eng |
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