Inductance and Resistance Calculations in Three-Dimensional Packaging Using Cylindrical Conduction-Mode Basis Functions
For the successful electrical design of system-in-package, this paper proposes an efficient method for extracting wideband resistance and inductance from a large number of 3-D interconnections. The proposed method uses the modal equivalent network from the electric field integral equation with cylin...
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| Veröffentlicht in: | IEEE transactions on computer-aided design of integrated circuits and systems 2009-06, Vol.28 (6), p.846-859 |
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| container_title | IEEE transactions on computer-aided design of integrated circuits and systems |
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| creator | Ki Jin Han Swaminathan, M. |
| description | For the successful electrical design of system-in-package, this paper proposes an efficient method for extracting wideband resistance and inductance from a large number of 3-D interconnections. The proposed method uses the modal equivalent network from the electric field integral equation with cylindrical conduction-mode basis function, which reduces the matrix size for large 3-D interconnection problems. Additional enhancement schemes proposed further reduce the cost for computing the partial inductances. Therefore, the method discussed in this paper can be used to construct accurate models of a large number of 3-D interconnection structures such as more than 100 bonding wires used for stacking chips. |
| doi_str_mv | 10.1109/TCAD.2009.2016642 |
| format | Article |
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The proposed method uses the modal equivalent network from the electric field integral equation with cylindrical conduction-mode basis function, which reduces the matrix size for large 3-D interconnection problems. Additional enhancement schemes proposed further reduce the cost for computing the partial inductances. Therefore, the method discussed in this paper can be used to construct accurate models of a large number of 3-D interconnection structures such as more than 100 bonding wires used for stacking chips.</description><identifier>ISSN: 0278-0070</identifier><identifier>EISSN: 1937-4151</identifier><identifier>DOI: 10.1109/TCAD.2009.2016642</identifier><identifier>CODEN: ITCSDI</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>Basis functions ; Bonding ; Bonding wires ; Computing costs ; Costs ; cylindrical conduction-mode basis function (CMBF) ; Design engineering ; electric field integral equation (EFIE) ; Electric fields ; Electric resistance ; Equivalent circuits ; Frequency ; Inductance ; Integral equations ; Integrated circuit interconnections ; Interconnections ; Mathematical models ; Packaging ; partial element equivalent circuit (PEEC) method ; proximity effect (PE) ; skin effect (SE) ; Stacking ; system-in-package (SIP) ; through-hole via (THV) interconnections ; Wires</subject><ispartof>IEEE transactions on computer-aided design of integrated circuits and systems, 2009-06, Vol.28 (6), p.846-859</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2009</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c390t-b48591fa02e44a40d5ea09300dfac908535f288772b0030220f8c0a6fd66b2db3</citedby><cites>FETCH-LOGICAL-c390t-b48591fa02e44a40d5ea09300dfac908535f288772b0030220f8c0a6fd66b2db3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/4957598$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,780,784,796,27924,27925,54758</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/4957598$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Ki Jin Han</creatorcontrib><creatorcontrib>Swaminathan, M.</creatorcontrib><title>Inductance and Resistance Calculations in Three-Dimensional Packaging Using Cylindrical Conduction-Mode Basis Functions</title><title>IEEE transactions on computer-aided design of integrated circuits and systems</title><addtitle>TCAD</addtitle><description>For the successful electrical design of system-in-package, this paper proposes an efficient method for extracting wideband resistance and inductance from a large number of 3-D interconnections. The proposed method uses the modal equivalent network from the electric field integral equation with cylindrical conduction-mode basis function, which reduces the matrix size for large 3-D interconnection problems. Additional enhancement schemes proposed further reduce the cost for computing the partial inductances. Therefore, the method discussed in this paper can be used to construct accurate models of a large number of 3-D interconnection structures such as more than 100 bonding wires used for stacking chips.</description><subject>Basis functions</subject><subject>Bonding</subject><subject>Bonding wires</subject><subject>Computing costs</subject><subject>Costs</subject><subject>cylindrical conduction-mode basis function (CMBF)</subject><subject>Design engineering</subject><subject>electric field integral equation (EFIE)</subject><subject>Electric fields</subject><subject>Electric resistance</subject><subject>Equivalent circuits</subject><subject>Frequency</subject><subject>Inductance</subject><subject>Integral equations</subject><subject>Integrated circuit interconnections</subject><subject>Interconnections</subject><subject>Mathematical models</subject><subject>Packaging</subject><subject>partial element equivalent circuit (PEEC) method</subject><subject>proximity effect (PE)</subject><subject>skin effect (SE)</subject><subject>Stacking</subject><subject>system-in-package (SIP)</subject><subject>through-hole via (THV) interconnections</subject><subject>Wires</subject><issn>0278-0070</issn><issn>1937-4151</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2009</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNpdkTFPwzAQhS0EEqXwAxBLxMKUcnbs2B5LSqFSEQi1c-Q4TnFJnRI3Qv33uA1iYLnTvfvuSaeH0DWGEcYg7xfZeDIiADIUnKaUnKABlgmPKWb4FA2AcBEDcDhHF96vATBlRA7Q98yVnd4pp02kXBm9G299P2aq1l2tdrZxPrIuWny0xsQTuzHOB03V0ZvSn2pl3Spa-kPN9rV1ZWt12GXN0TiA8UtTmuhBBeNo2rmj5i_RWaVqb65--xAtp4-L7Dmevz7NsvE81omEXVxQwSSuFBBDqaJQMqNAJgBlpbQEwRJWESE4JwVAAoRAJTSotCrTtCBlkQzRXe-7bZuvzvhdvrFem7pWzjSdzwVnkGBMSCBv_5HrpmvDmwFinNKUCB4g3EO6bbxvTZVvW7tR7T7HkB-CyA9B5Icg8t8gws1Nf2ONMX88lYwzKZIfxqKEwA</recordid><startdate>20090601</startdate><enddate>20090601</enddate><creator>Ki Jin Han</creator><creator>Swaminathan, M.</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. 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The proposed method uses the modal equivalent network from the electric field integral equation with cylindrical conduction-mode basis function, which reduces the matrix size for large 3-D interconnection problems. Additional enhancement schemes proposed further reduce the cost for computing the partial inductances. Therefore, the method discussed in this paper can be used to construct accurate models of a large number of 3-D interconnection structures such as more than 100 bonding wires used for stacking chips.</abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/TCAD.2009.2016642</doi><tpages>14</tpages></addata></record> |
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| identifier | ISSN: 0278-0070 |
| ispartof | IEEE transactions on computer-aided design of integrated circuits and systems, 2009-06, Vol.28 (6), p.846-859 |
| issn | 0278-0070 1937-4151 |
| language | eng |
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| source | IEEE Electronic Library (IEL) |
| subjects | Basis functions Bonding Bonding wires Computing costs Costs cylindrical conduction-mode basis function (CMBF) Design engineering electric field integral equation (EFIE) Electric fields Electric resistance Equivalent circuits Frequency Inductance Integral equations Integrated circuit interconnections Interconnections Mathematical models Packaging partial element equivalent circuit (PEEC) method proximity effect (PE) skin effect (SE) Stacking system-in-package (SIP) through-hole via (THV) interconnections Wires |
| title | Inductance and Resistance Calculations in Three-Dimensional Packaging Using Cylindrical Conduction-Mode Basis Functions |
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