Bandwidth Study of the Stacked Mushroom EBG Unit Cells
The stacked mushroom-shaped (SMS) electromagnetic bandgap (EBG) unit cell and its design procedure are presented. The cell structure is suggested to reduce the cell size and overcome the problems of manufacturing mushroom-shaped EBG cells over a thick dielectric substrate for low-frequency and wideb...
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Veröffentlicht in: | IEEE transactions on antennas and propagation 2017-08, Vol.65 (8), p.4357-4362 |
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description | The stacked mushroom-shaped (SMS) electromagnetic bandgap (EBG) unit cell and its design procedure are presented. The cell structure is suggested to reduce the cell size and overcome the problems of manufacturing mushroom-shaped EBG cells over a thick dielectric substrate for low-frequency and wideband applications. A comparison between the SMS cell and the conventional mushroom-shaped cell is introduced based on the achievable frequency bandgap. Moreover, a parametric study is performed to highlight both the electrical and mechanical advantages of the SMS EBG structure. Finally, a prototype of a packaged microstrip line is built to verify the characteristics learned from the numerical analysis. |
doi_str_mv | 10.1109/TAP.2017.2710258 |
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The cell structure is suggested to reduce the cell size and overcome the problems of manufacturing mushroom-shaped EBG cells over a thick dielectric substrate for low-frequency and wideband applications. A comparison between the SMS cell and the conventional mushroom-shaped cell is introduced based on the achievable frequency bandgap. Moreover, a parametric study is performed to highlight both the electrical and mechanical advantages of the SMS EBG structure. Finally, a prototype of a packaged microstrip line is built to verify the characteristics learned from the numerical analysis.</description><identifier>ISSN: 0018-926X</identifier><identifier>EISSN: 1558-2221</identifier><identifier>DOI: 10.1109/TAP.2017.2710258</identifier><identifier>CODEN: IETPAK</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>Air gaps ; Artificial magnetic conductor (AMC) ; Bandwidth ; Broadband ; Capacitors ; electromagnetic shielding ; Integrated circuit modeling ; Numerical analysis ; packaging ; Photonic band gap ; Substrates ; Unit cell</subject><ispartof>IEEE transactions on antennas and propagation, 2017-08, Vol.65 (8), p.4357-4362</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. 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The cell structure is suggested to reduce the cell size and overcome the problems of manufacturing mushroom-shaped EBG cells over a thick dielectric substrate for low-frequency and wideband applications. A comparison between the SMS cell and the conventional mushroom-shaped cell is introduced based on the achievable frequency bandgap. Moreover, a parametric study is performed to highlight both the electrical and mechanical advantages of the SMS EBG structure. Finally, a prototype of a packaged microstrip line is built to verify the characteristics learned from the numerical analysis.</description><subject>Air gaps</subject><subject>Artificial magnetic conductor (AMC)</subject><subject>Bandwidth</subject><subject>Broadband</subject><subject>Capacitors</subject><subject>electromagnetic shielding</subject><subject>Integrated circuit modeling</subject><subject>Numerical analysis</subject><subject>packaging</subject><subject>Photonic band gap</subject><subject>Substrates</subject><subject>Unit cell</subject><issn>0018-926X</issn><issn>1558-2221</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2017</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNo9kEFLAzEQRoMoWKt3wUvA867JJNlsjm2pVago2IK3kGQTurXt1mQX6b93S4un4YP3zQwPoXtKckqJelqMPnIgVOYgKQFRXqABFaLMAIBeogEhtMwUFF_X6CaldR95yfkAFWOzq37rql3hz7arDrgJuF35Phj37Sv81qVVbJotno5neLmrWzzxm026RVfBbJK_O88hWj5PF5OXbP4-e52M5pkDRdvMAlNgoWDE8iCd9QaE5WUwnBNnnSTeKAHWAifEU8kF778C74IBkKFibIgeT3v3sfnpfGr1uunirj-pqQLJqOICeoqcKBeblKIPeh_rrYkHTYk-2tG9HX20o892-srDqVJ77_9xqVghCGd_QJZeQg</recordid><startdate>20170801</startdate><enddate>20170801</enddate><creator>Moharram Hassan, Mohamed A.</creator><creator>Kishk, Ahmed A.</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. 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The cell structure is suggested to reduce the cell size and overcome the problems of manufacturing mushroom-shaped EBG cells over a thick dielectric substrate for low-frequency and wideband applications. A comparison between the SMS cell and the conventional mushroom-shaped cell is introduced based on the achievable frequency bandgap. Moreover, a parametric study is performed to highlight both the electrical and mechanical advantages of the SMS EBG structure. Finally, a prototype of a packaged microstrip line is built to verify the characteristics learned from the numerical analysis.</abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/TAP.2017.2710258</doi><tpages>6</tpages><orcidid>https://orcid.org/0000-0002-7118-0008</orcidid></addata></record> |
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subjects | Air gaps Artificial magnetic conductor (AMC) Bandwidth Broadband Capacitors electromagnetic shielding Integrated circuit modeling Numerical analysis packaging Photonic band gap Substrates Unit cell |
title | Bandwidth Study of the Stacked Mushroom EBG Unit Cells |
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