A Rigorous and Efficient Analysis of 3-D Printed Circuits: Vertical Conductors Arbitrarily Distributed in Multilayer Environment
The combination of the method of moments and the discrete complex image method is extended to multilayered printed circuits with vertical conductors crossing more than one layer and/or located in different layers. Some realistic printed circuits with multilayered vertical strips are analyzed, and re...
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Veröffentlicht in: | IEEE transactions on antennas and propagation 2007-12, Vol.55 (12), p.3726-3729 |
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creator | Onal, T. Aksun, M.I. Kinayman, N. |
description | The combination of the method of moments and the discrete complex image method is extended to multilayered printed circuits with vertical conductors crossing more than one layer and/or located in different layers. Some realistic printed circuits with multilayered vertical strips are analyzed, and results are compared either to those presented in the literature or to those obtained from the commercial software em by SONNET Software, North Syracuse, NY. In addition, it is demonstrated that this extension has facilitated the use of a recently developed algorithm, which was specifically developed for the efficient handling of multiple vertical conductors, for the analysis of structures with multiple vertical strips running in multilayer environment. |
doi_str_mv | 10.1109/TAP.2007.910498 |
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Some realistic printed circuits with multilayered vertical strips are analyzed, and results are compared either to those presented in the literature or to those obtained from the commercial software em by SONNET Software, North Syracuse, NY. 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Some realistic printed circuits with multilayered vertical strips are analyzed, and results are compared either to those presented in the literature or to those obtained from the commercial software em by SONNET Software, North Syracuse, NY. In addition, it is demonstrated that this extension has facilitated the use of a recently developed algorithm, which was specifically developed for the efficient handling of multiple vertical conductors, for the analysis of structures with multiple vertical strips running in multilayer environment.</description><subject>Algorithm design and analysis</subject><subject>Antennas</subject><subject>Applied sciences</subject><subject>Circuit simulation</subject><subject>Computational modeling</subject><subject>Computer programs</subject><subject>Conductors</subject><subject>Discrete-complex-image method</subject><subject>Electronic equipment and fabrication. Passive components, printed wiring boards, connectics</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Integral equations</subject><subject>Integrated circuit packaging</subject><subject>method of moments (MoM)</subject><subject>Moment methods</subject><subject>multilayered 3-D printed circuits</subject><subject>Multilayers</subject><subject>Nonhomogeneous media</subject><subject>Printed circuits</subject><subject>Software</subject><subject>Strip</subject><subject>Strips</subject><issn>0018-926X</issn><issn>1558-2221</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2007</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNp9kc9rFDEUx4NYcK2ePXgJgnqabV4ymUm8Ddv1B7S0SBVvIZvNyCuzSZtkhL35p5tli4KHnh7hfb7fR75fQl4BWwIwfXYzXC85Y_1SA2u1ekIWIKVqOOfwlCwYA9Vo3v14Rp7nfFufrWrbBfk90K_4M6Y4Z2rDlq7HER36UOgQ7LTPmGkcqWjO6XXCUPyWrjC5GUv-QL_7VNDZia5i2M6uxJTpkDZYkk047ek55pJwMx9UGOjlPBWc7N4nug6_MMWwq3dekJPRTtm_fJin5NvH9c3qc3Nx9enLarhonFBQmtH1XHZaWd0LJa1y0IH0gsFWCBAcbKed7vvRbVivmRWi1a3lIOtScm434pS8P_repXg_-1zMDrPz02SDr583Snege91DJd89SopW8q5GWcE3_4G3cU41tmw0cC40h4Pb2RFyKeac_GjuEu5s2htg5lCcqcWZQ3HmWFxVvH2wtbmmOyYbHOZ_Mq2U5kpW7vWRQ-_933UrlALQ4g989KAf</recordid><startdate>20071201</startdate><enddate>20071201</enddate><creator>Onal, T.</creator><creator>Aksun, M.I.</creator><creator>Kinayman, N.</creator><general>IEEE</general><general>Institute of Electrical and Electronics Engineers</general><general>The Institute of Electrical and Electronics Engineers, Inc. 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Passive components, printed wiring boards, connectics</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Integral equations</topic><topic>Integrated circuit packaging</topic><topic>method of moments (MoM)</topic><topic>Moment methods</topic><topic>multilayered 3-D printed circuits</topic><topic>Multilayers</topic><topic>Nonhomogeneous media</topic><topic>Printed circuits</topic><topic>Software</topic><topic>Strip</topic><topic>Strips</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Onal, T.</creatorcontrib><creatorcontrib>Aksun, M.I.</creatorcontrib><creatorcontrib>Kinayman, N.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005–Present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998–Present</collection><collection>IEEE Xplore (Online service)</collection><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><jtitle>IEEE transactions on antennas and propagation</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Onal, T.</au><au>Aksun, M.I.</au><au>Kinayman, N.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>A Rigorous and Efficient Analysis of 3-D Printed Circuits: Vertical Conductors Arbitrarily Distributed in Multilayer Environment</atitle><jtitle>IEEE transactions on antennas and propagation</jtitle><stitle>TAP</stitle><date>2007-12-01</date><risdate>2007</risdate><volume>55</volume><issue>12</issue><spage>3726</spage><epage>3729</epage><pages>3726-3729</pages><issn>0018-926X</issn><eissn>1558-2221</eissn><coden>IETPAK</coden><abstract>The combination of the method of moments and the discrete complex image method is extended to multilayered printed circuits with vertical conductors crossing more than one layer and/or located in different layers. 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subjects | Algorithm design and analysis Antennas Applied sciences Circuit simulation Computational modeling Computer programs Conductors Discrete-complex-image method Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Exact sciences and technology Integral equations Integrated circuit packaging method of moments (MoM) Moment methods multilayered 3-D printed circuits Multilayers Nonhomogeneous media Printed circuits Software Strip Strips |
title | A Rigorous and Efficient Analysis of 3-D Printed Circuits: Vertical Conductors Arbitrarily Distributed in Multilayer Environment |
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