Improved underfill adhesion in flip-chip packages by means of ultraviolet light/ozone treatment

The interfacial adhesion between the epoxy-based soldermask and underfill resin is successfully improved by means of ultraviolet light/ozone (UV/O/sub 3/) treatment. There is an optimized treatment condition that can impart the highest interfacial bond quality. The underlying mechanisms are evaluate...

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Veröffentlicht in:	IEEE transactions on advanced packaging 2004-02, Vol.27 (1), p.179-187
Hauptverfasser:	Sham, M.-L.I., Jang-Kyo Kim
Format:	Artikel
Sprache:	eng
Schlagworte:	Adhesion Adhesives Aging Applied sciences Bond strength Bonding Chemical elements Contact angle Design. Technologies. Operation analysis. Testing Elastic modulus Electronics Exact sciences and technology Goniometers Integrated circuits Ozone Packaging Particle measurements Resins Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Spectroscopy Studies Surface treatment Ultraviolet Wettability X-ray photoelectron spectroscopy
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