The design and assembly of surface-micromachined optical switch for optical add/drop multiplexer application

An assembly process including: flip-chip bonding, microelectromechanical (MEMS) structure release, and atomic layer deposition (ALD) is proposed to integrate a surface micromachined optical switch for optical add/drop multiplexer (OADM) applications. In the current optical switch designs, pre-stress...

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Veröffentlicht in:	IEEE transactions on advanced packaging 2003-08, Vol.26 (3), p.261-267
Hauptverfasser:	LIN, Yu-Chen, CHIOU, Jin-Chern, LIN, Wei-Ting, LIN, Yung-Jiun, WU, Shuen-De
Format:	Artikel
Sprache:	eng
Schlagworte:	Add-drop multiplexers Applied sciences Assembly Atom optics Atomic layer deposition Bonding Circuit properties Design Design. Technologies. Operation analysis. Testing Electric, optical and optoelectronic circuits Electronics Exact sciences and technology Fiber optic networks Integrated circuits Integrated optics. Optical fibers and wave guides Micro- and nanoelectromechanical devices (mems/nems) Micromechanical devices Micromirrors Optical add-drop multiplexers Optical and optoelectronic circuits Optical design Optical industry Optical switches Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
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