Wafer-Level Fabrication of Microcube-Typed Beam-Splitters by Saw-Dicing of Glass Substrate

This letter reports on the development of an integrated micro-optical beam splitter that can be array-arranged. The proposed wafer-level fabrication, based on 45 ° saw-dicing of glass substrates, allows rapid and low-cost processing. In particular, it leads to high compactness and possibility of waf...

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Veröffentlicht in:	IEEE photonics technology letters 2014-01, Vol.26 (1), p.100-103
Hauptverfasser:	Baranski, Maciej, Bargiel, Sylwester, Passilly, Nicolas, Guichardaz, Blandine, Herth, Etienne, Gorecki, Christophe, Chenping Jia, Fromel, Jorg, Wiemer, Maik
Format:	Artikel
Sprache:	eng
Schlagworte:	Blades Glass Laser beams Optical beam splitting optical components Optical device fabrication optical devices fabrication Substrates Surface treatment
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