Wafer-Level Fabrication of Microcube-Typed Beam-Splitters by Saw-Dicing of Glass Substrate
This letter reports on the development of an integrated micro-optical beam splitter that can be array-arranged. The proposed wafer-level fabrication, based on 45 ° saw-dicing of glass substrates, allows rapid and low-cost processing. In particular, it leads to high compactness and possibility of waf...
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| Veröffentlicht in: | IEEE photonics technology letters 2014-01, Vol.26 (1), p.100-103 |
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| container_end_page | 103 |
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| container_title | IEEE photonics technology letters |
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| creator | Baranski, Maciej Bargiel, Sylwester Passilly, Nicolas Guichardaz, Blandine Herth, Etienne Gorecki, Christophe Chenping Jia Fromel, Jorg Wiemer, Maik |
| description | This letter reports on the development of an integrated micro-optical beam splitter that can be array-arranged. The proposed wafer-level fabrication, based on 45 ° saw-dicing of glass substrates, allows rapid and low-cost processing. In particular, it leads to high compactness and possibility of wafer-level alignment/assembly, suitable for vertically integrated imaging micro-instruments. The device, including additional out-of plane reflection for extraction of sensing beam, can be as small as 1 mm 3 . |
| doi_str_mv | 10.1109/LPT.2013.2289981 |
| format | Article |
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| ispartof | IEEE photonics technology letters, 2014-01, Vol.26 (1), p.100-103 |
| issn | 1041-1135 1941-0174 |
| language | eng |
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| source | IEEE Electronic Library (IEL) |
| subjects | Blades Glass Laser beams Optical beam splitting optical components Optical device fabrication optical devices fabrication Substrates Surface treatment |
| title | Wafer-Level Fabrication of Microcube-Typed Beam-Splitters by Saw-Dicing of Glass Substrate |
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