3D MEMS In-Chip Solenoid Inductor With High Inductance Density for Power MEMS Device

In this letter, we report the design and measurement of a 3D solenoid inductor that is embedded in a Si substrate and can integrate an iron core. Various inductor designs were fabricated with good structural integrity and repeatability via a CMOS-compatible MEMS fabrication process. The average indu...

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Veröffentlicht in:	IEEE electron device letters 2019-11, Vol.40 (11), p.1816-1819
Hauptverfasser:	Xu, Tiantong, Sun, Jiamian, Wu, Hanxiao, Li, Haiwang, Li, Hanqing, Tao, Zhi
Format:	Artikel
Sprache:	eng
Schlagworte:	CMOS CMOS-compatible fabrication process Density high inductance density Inductance Inductors Iron Microelectromechanical systems Micromechanical devices power MEMS Q factors Reproducibility Silicon Silicon substrates Solenoid inductor Solenoids Structural integrity Substrates
Online-Zugang:	Volltext
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