Low-Dissipation Silicon Tuning Fork Gyroscopes for Rate and Whole Angle Measurements
We report a new family of ultra high- Q silicon microelectromechanical systems (MEMS) tuning fork gyroscopes demonstrating angular rate and, for the first time, rate integrating (whole angle) operation. The novel mechanical architecture maximizes the Q-factor and minimizes frequency and damping mism...
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| Veröffentlicht in: | IEEE sensors journal 2011-11, Vol.11 (11), p.2763-2770 |
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| container_title | IEEE sensors journal |
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| creator | Trusov, A. A. Prikhodko, I. P. Zotov, S. A. Shkel, A. M. |
| description | We report a new family of ultra high- Q silicon microelectromechanical systems (MEMS) tuning fork gyroscopes demonstrating angular rate and, for the first time, rate integrating (whole angle) operation. The novel mechanical architecture maximizes the Q-factor and minimizes frequency and damping mismatches. We demonstrated the vacuum packaged SOI dual and quadruple mass gyroscopes with Q-factors of 0.64 and 0.86 million at 2 kHz operational frequency, respectively. Due to the stiffness and damping symmetry, the quadruple mass gyroscope was instrumented to measure the angle of rotation directly, eliminating the bandwidth and dynamic range limitations of conventional MEMS vibratory rate gyroscopes. The technology may enable silicon micromachined devices for inertial guidance applications previously limited to precision-machined quartz hemispherical resonator gyroscopes. |
| doi_str_mv | 10.1109/JSEN.2011.2160338 |
| format | Article |
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A. ; Prikhodko, I. P. ; Zotov, S. A. ; Shkel, A. M.</creator><creatorcontrib>Trusov, A. A. ; Prikhodko, I. P. ; Zotov, S. A. ; Shkel, A. M.</creatorcontrib><description>We report a new family of ultra high- Q silicon microelectromechanical systems (MEMS) tuning fork gyroscopes demonstrating angular rate and, for the first time, rate integrating (whole angle) operation. The novel mechanical architecture maximizes the Q-factor and minimizes frequency and damping mismatches. We demonstrated the vacuum packaged SOI dual and quadruple mass gyroscopes with Q-factors of 0.64 and 0.86 million at 2 kHz operational frequency, respectively. Due to the stiffness and damping symmetry, the quadruple mass gyroscope was instrumented to measure the angle of rotation directly, eliminating the bandwidth and dynamic range limitations of conventional MEMS vibratory rate gyroscopes. The technology may enable silicon micromachined devices for inertial guidance applications previously limited to precision-machined quartz hemispherical resonator gyroscopes.</description><identifier>ISSN: 1530-437X</identifier><identifier>EISSN: 1558-1748</identifier><identifier>DOI: 10.1109/JSEN.2011.2160338</identifier><identifier>CODEN: ISJEAZ</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>Damping ; Dynamic range ; Energy dissipation ; Frequency measurement ; Gyroscopes ; Microelectromechanical systems ; microelectromechanical systems (MEMS) gyroscope ; Micromachining ; Micromechanics ; Q factor ; quality factor ; rate integrating ; Sensors ; Silicon ; Temperature measurement ; Tuning fork gyroscopes ; vacuum packaging ; Vibrations ; whole angle</subject><ispartof>IEEE sensors journal, 2011-11, Vol.11 (11), p.2763-2770</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) Nov 2011</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c434t-1ae19ed4309846213a67a6959e26c0843d91a00709a2d5494021a122152f77bc3</citedby><cites>FETCH-LOGICAL-c434t-1ae19ed4309846213a67a6959e26c0843d91a00709a2d5494021a122152f77bc3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/5928378$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,776,780,792,27901,27902,54733</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/5928378$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Trusov, A. A.</creatorcontrib><creatorcontrib>Prikhodko, I. P.</creatorcontrib><creatorcontrib>Zotov, S. A.</creatorcontrib><creatorcontrib>Shkel, A. M.</creatorcontrib><title>Low-Dissipation Silicon Tuning Fork Gyroscopes for Rate and Whole Angle Measurements</title><title>IEEE sensors journal</title><addtitle>JSEN</addtitle><description>We report a new family of ultra high- Q silicon microelectromechanical systems (MEMS) tuning fork gyroscopes demonstrating angular rate and, for the first time, rate integrating (whole angle) operation. The novel mechanical architecture maximizes the Q-factor and minimizes frequency and damping mismatches. We demonstrated the vacuum packaged SOI dual and quadruple mass gyroscopes with Q-factors of 0.64 and 0.86 million at 2 kHz operational frequency, respectively. Due to the stiffness and damping symmetry, the quadruple mass gyroscope was instrumented to measure the angle of rotation directly, eliminating the bandwidth and dynamic range limitations of conventional MEMS vibratory rate gyroscopes. The technology may enable silicon micromachined devices for inertial guidance applications previously limited to precision-machined quartz hemispherical resonator gyroscopes.</description><subject>Damping</subject><subject>Dynamic range</subject><subject>Energy dissipation</subject><subject>Frequency measurement</subject><subject>Gyroscopes</subject><subject>Microelectromechanical systems</subject><subject>microelectromechanical systems (MEMS) gyroscope</subject><subject>Micromachining</subject><subject>Micromechanics</subject><subject>Q factor</subject><subject>quality factor</subject><subject>rate integrating</subject><subject>Sensors</subject><subject>Silicon</subject><subject>Temperature measurement</subject><subject>Tuning fork gyroscopes</subject><subject>vacuum packaging</subject><subject>Vibrations</subject><subject>whole angle</subject><issn>1530-437X</issn><issn>1558-1748</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2011</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNpdkE1PwzAMhisEEuPjByAuFScuHXaSNslxGtsADZDYENyi0HkQ6JqRtEL8ezoNceBi-_C8lv0kyQlCHxH0xc1sdNdngNhnWADnaifpYZ6rDKVQu5uZQya4fN5PDmJ8B0Atc9lL5lP_lV26GN3aNs7X6cxVruz6vK1d_ZqOffhIJ9_Bx9KvKaZLH9IH21Bq60X69OYrSgf1a1dvycY20IrqJh4le0tbRTr-7YfJ43g0H15l0_vJ9XAwzUrBRZOhJdS0EBy0EgVDbgtpC51rYkUJSvCFRgsgQVu2yIUWwNAiY5izpZQvJT9Mzrd718F_thQbs3KxpKqyNfk2GuRdiDGlZIee_UPffRvq7jqjAaBAULyDcAuV3b8x0NKsg1vZ8G0QzEaz2Wg2G83mV3OXOd1mHBH98blmikvFfwDx1na1</recordid><startdate>20111101</startdate><enddate>20111101</enddate><creator>Trusov, A. 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A.</creatorcontrib><creatorcontrib>Prikhodko, I. P.</creatorcontrib><creatorcontrib>Zotov, S. A.</creatorcontrib><creatorcontrib>Shkel, A. M.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005–Present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998–Present</collection><collection>IEL</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><jtitle>IEEE sensors journal</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Trusov, A. A.</au><au>Prikhodko, I. P.</au><au>Zotov, S. A.</au><au>Shkel, A. M.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Low-Dissipation Silicon Tuning Fork Gyroscopes for Rate and Whole Angle Measurements</atitle><jtitle>IEEE sensors journal</jtitle><stitle>JSEN</stitle><date>2011-11-01</date><risdate>2011</risdate><volume>11</volume><issue>11</issue><spage>2763</spage><epage>2770</epage><pages>2763-2770</pages><issn>1530-437X</issn><eissn>1558-1748</eissn><coden>ISJEAZ</coden><abstract>We report a new family of ultra high- Q silicon microelectromechanical systems (MEMS) tuning fork gyroscopes demonstrating angular rate and, for the first time, rate integrating (whole angle) operation. The novel mechanical architecture maximizes the Q-factor and minimizes frequency and damping mismatches. We demonstrated the vacuum packaged SOI dual and quadruple mass gyroscopes with Q-factors of 0.64 and 0.86 million at 2 kHz operational frequency, respectively. Due to the stiffness and damping symmetry, the quadruple mass gyroscope was instrumented to measure the angle of rotation directly, eliminating the bandwidth and dynamic range limitations of conventional MEMS vibratory rate gyroscopes. The technology may enable silicon micromachined devices for inertial guidance applications previously limited to precision-machined quartz hemispherical resonator gyroscopes.</abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/JSEN.2011.2160338</doi><tpages>8</tpages><oa>free_for_read</oa></addata></record> |
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| ispartof | IEEE sensors journal, 2011-11, Vol.11 (11), p.2763-2770 |
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| source | IEL |
| subjects | Damping Dynamic range Energy dissipation Frequency measurement Gyroscopes Microelectromechanical systems microelectromechanical systems (MEMS) gyroscope Micromachining Micromechanics Q factor quality factor rate integrating Sensors Silicon Temperature measurement Tuning fork gyroscopes vacuum packaging Vibrations whole angle |
| title | Low-Dissipation Silicon Tuning Fork Gyroscopes for Rate and Whole Angle Measurements |
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