Characterization of the Temperature Dependence of the Piezoresistive Coefficients of Silicon From 150\,^C to 125\,^C

Stress sensing test chips are widely utilized to investigate integrated circuit die stresses arising from assembly and packaging operations. In order to utilize these test chips to measure stresses over a wide range of temperatures, one must have values of six piezoresistive coefficients for n- and...

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Veröffentlicht in:	IEEE sensors journal 2008-08, Vol.8 (8), p.1455-1468
Hauptverfasser:	Chun-Hyung Cho, Jaeger, R.C., Suhling, J.C.
Format:	Artikel
Sprache:	eng
Schlagworte:	Assembly Circuit testing Integrated circuit packaging Integrated circuit testing Piezoresistance piezoresistive coefficients Silicon Stress measurement stress sensors Temperature dependence Temperature distribution Temperature sensors
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