Origami-Inspired Fabrication of High-Performance Wafer-Level Packaged Three-Dimensional Radio-Frequency Inductors

Planar radio-frequency (RF) on-chip inductors suffer from large electromagnetic losses, stemming from the low resistivity silicon substrate. Though it is well-known that 3-dimensional (3D) MEMS-based RF inductors offer significant performance enhancement by reducing the substrate proximity effects,...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	Journal of microelectromechanical systems 2023-08, Vol.32 (4), p.1-8
Hauptverfasser:	Bajwa, Rayan, Yapici, Murat Kaya
Format:	Artikel
Sprache:	eng
Schlagworte:	<inline-formula xmlns:ali="http://www.niso.org/schemas/ali/1.0/" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance"> <tex-math notation="LaTeX"> Q</tex-math> </inline-formula>-factor Baking Bending Chromium Commercialization Electromagnetic losses Electronic packaging Fragility inductor Inductors microelectromechanical devices Microfabrication Performance enhancement polymer encapsulation Polymers Q-factor Radio frequency Reliability Residual stress RF-MEMS Self-assembly Silicon substrates Stress Substrates Thickness Thin films Three-dimensional displays wafer-level packaging
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!