Limits to Thermal-Piezoresistive Cooling in Silicon Micromechanical Resonators
We study thermal-piezoresistive cooling in silicon micromechanical resonators at large currents and high temperatures. Crossing a thermal transition region corresponds to a steep reduction in resonance frequency, an abrupt plateauing in the effective quality factor, and a large increase in thermomec...
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| Veröffentlicht in: | Journal of microelectromechanical systems 2020-10, Vol.29 (5), p.677-684 |
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| container_title | Journal of microelectromechanical systems |
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| creator | Miller, James M. L. Zhu, Haoshen Sundaram, Subramanian Vukasin, Gabrielle D. Chen, Yunhan Flader, Ian B. Shin, Dongsuk D. Kenny, Thomas W. |
| description | We study thermal-piezoresistive cooling in silicon micromechanical resonators at large currents and high temperatures. Crossing a thermal transition region corresponds to a steep reduction in resonance frequency, an abrupt plateauing in the effective quality factor, and a large increase in thermomechanical fluctuations. Comparing measurements with simulations suggests that the second-order temperature coefficients of elasticity of doped silicon are not sufficient to capture the drop in resonance frequency at large currents. Overall, our results show that there are clear thermal limits to cooling a resonant mode using current-controlled thermal-piezoresistive feedback in silicon. [2020-0205] |
| doi_str_mv | 10.1109/JMEMS.2020.3022050 |
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Comparing measurements with simulations suggests that the second-order temperature coefficients of elasticity of doped silicon are not sufficient to capture the drop in resonance frequency at large currents. Overall, our results show that there are clear thermal limits to cooling a resonant mode using current-controlled thermal-piezoresistive feedback in silicon. 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L.</au><au>Zhu, Haoshen</au><au>Sundaram, Subramanian</au><au>Vukasin, Gabrielle D.</au><au>Chen, Yunhan</au><au>Flader, Ian B.</au><au>Shin, Dongsuk D.</au><au>Kenny, Thomas W.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Limits to Thermal-Piezoresistive Cooling in Silicon Micromechanical Resonators</atitle><jtitle>Journal of microelectromechanical systems</jtitle><stitle>JMEMS</stitle><date>2020-10-01</date><risdate>2020</risdate><volume>29</volume><issue>5</issue><spage>677</spage><epage>684</epage><pages>677-684</pages><issn>1057-7157</issn><eissn>1941-0158</eissn><coden>JMIYET</coden><abstract>We study thermal-piezoresistive cooling in silicon micromechanical resonators at large currents and high temperatures. Crossing a thermal transition region corresponds to a steep reduction in resonance frequency, an abrupt plateauing in the effective quality factor, and a large increase in thermomechanical fluctuations. 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| source | IEEE Electronic Library (IEL) |
| subjects | Actuators Cooling Current measurement elastic modulus Frequency measurement MEMS microresonators Q factors Resonance Resonant frequency Resonators Semiconductor device measurement Silicon Temperature measurement thermal conductivity thermal-piezoresistive pumping |
| title | Limits to Thermal-Piezoresistive Cooling in Silicon Micromechanical Resonators |
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