Shape Memory Alloy Actuators for Silicon Microgrippers
The fabrication of shape memory alloy NiTi actuators by femtosecond laser ablation is presented. Processing parameters are examined and the effect of the ablation process on the shape memory material properties is assessed by electron microscopy and differential scanning calorimetry. It is shown tha...
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| Veröffentlicht in: | Journal of microelectromechanical systems 2019-10, Vol.28 (5), p.869-881 |
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| container_title | Journal of microelectromechanical systems |
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| creator | Garces-Schroder, Mayra Zimmermann, Tom Siemers, Carsten Leester-Schadel, Monika Bol, Markus Dietzel, Andreas |
| description | The fabrication of shape memory alloy NiTi actuators by femtosecond laser ablation is presented. Processing parameters are examined and the effect of the ablation process on the shape memory material properties is assessed by electron microscopy and differential scanning calorimetry. It is shown that an efficient ablation process with negligible effect on the shape memory properties of the actuator material has been established with a cutting time of ~3 min per actuator. Two different actuator geometries are studied and their performances are compared by measurements of actuator stroke, force and resistance characteristics. A preconditioning procedure for stabilization of the resistance is presented, permitting an actuator control based on the intrinsic sensor effect. A wafer-level integration process of the actuators into silicon microgrippers is described. |
| doi_str_mv | 10.1109/JMEMS.2019.2936288 |
| format | Article |
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Processing parameters are examined and the effect of the ablation process on the shape memory material properties is assessed by electron microscopy and differential scanning calorimetry. It is shown that an efficient ablation process with negligible effect on the shape memory properties of the actuator material has been established with a cutting time of ~3 min per actuator. Two different actuator geometries are studied and their performances are compared by measurements of actuator stroke, force and resistance characteristics. A preconditioning procedure for stabilization of the resistance is presented, permitting an actuator control based on the intrinsic sensor effect. 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Processing parameters are examined and the effect of the ablation process on the shape memory material properties is assessed by electron microscopy and differential scanning calorimetry. It is shown that an efficient ablation process with negligible effect on the shape memory properties of the actuator material has been established with a cutting time of ~3 min per actuator. Two different actuator geometries are studied and their performances are compared by measurements of actuator stroke, force and resistance characteristics. A preconditioning procedure for stabilization of the resistance is presented, permitting an actuator control based on the intrinsic sensor effect. A wafer-level integration process of the actuators into silicon microgrippers is described.</description><subject>Actuators</subject><subject>Femtosecond laser ablation</subject><subject>Grippers</subject><subject>Laser ablation</subject><subject>Laser beam cutting</subject><subject>Laser beams</subject><subject>Material properties</subject><subject>Measurement by laser beam</subject><subject>microfabrication</subject><subject>microgripper microactuator</subject><subject>Nickel base alloys</subject><subject>Preconditioning</subject><subject>Process parameters</subject><subject>Shape effects</subject><subject>Shape memory alloys</subject><subject>Silicon</subject><issn>1057-7157</issn><issn>1941-0158</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2019</creationdate><recordtype>article</recordtype><sourceid>ESBDL</sourceid><sourceid>RIE</sourceid><recordid>eNo9kMtOwzAQRS0EEqXwA7CJxDrF78eyqkoBNWIRWFuJO4FUaR3sdNG_xyUVm5nR6N65o4PQPcEzQrB5eiuWRTmjmJgZNUxSrS_QhBhOckyEvkwzFipXRKhrdBPjFmPCuZYTJMvvqoesgJ0Px2zedT5VNxyqwYeYNT5kZdu1zu-zonXBf4W27yHEW3TVVF2Eu3Ofos_n5cfiJV-_r14X83XuOBZDXte8brTijGKhgUmR1rx2G60qDqYWDXHSSUbZhgmnjJCUAqPCKAFUEtmwKXoc7_bB_xwgDnbrD2GfIi1lGDOmuVJJRUdV-jDGAI3tQ7urwtESbE987B8fe-Jjz3yS6WE0tQDwb9A6iThlv1wyX8Q</recordid><startdate>20191001</startdate><enddate>20191001</enddate><creator>Garces-Schroder, Mayra</creator><creator>Zimmermann, Tom</creator><creator>Siemers, Carsten</creator><creator>Leester-Schadel, Monika</creator><creator>Bol, Markus</creator><creator>Dietzel, Andreas</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. 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A wafer-level integration process of the actuators into silicon microgrippers is described.</abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/JMEMS.2019.2936288</doi><tpages>13</tpages><orcidid>https://orcid.org/0000-0002-5598-9712</orcidid><orcidid>https://orcid.org/0000-0003-4076-5887</orcidid><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| source | IEEE Electronic Library (IEL) |
| subjects | Actuators Femtosecond laser ablation Grippers Laser ablation Laser beam cutting Laser beams Material properties Measurement by laser beam microfabrication microgripper microactuator Nickel base alloys Preconditioning Process parameters Shape effects Shape memory alloys Silicon |
| title | Shape Memory Alloy Actuators for Silicon Microgrippers |
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