Optical Fiber-Based Confocal and Interferometric System for Measuring the Depth and Diameter of Through Silicon Vias
To measure the depth and diameter of through silicon vias simultaneously, a novel method based on spectral-domain interferometer and confocal microscope is proposed and realized. Most parts of the measurement system are constructed with optical fiber components for flexible configuration and easy al...
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Veröffentlicht in: | Journal of lightwave technology 2016-12, Vol.34 (23), p.5462-5466 |
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creator | Ahn, Heulbi Park, Jungjae Kim, Jong-Ahn Jin, Jonghan |
description | To measure the depth and diameter of through silicon vias simultaneously, a novel method based on spectral-domain interferometer and confocal microscope is proposed and realized. Most parts of the measurement system are constructed with optical fiber components for flexible configuration and easy alignment. According to the measurement results and performance evaluation, the mean values of the diameter and depth were 6.07 μm and 48.255 μm with the expanded uncertainties of 0.20 μm (k = 2) and 37 nm (k = 2), respectively. |
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According to the measurement results and performance evaluation, the mean values of the diameter and depth were 6.07 μm and 48.255 μm with the expanded uncertainties of 0.20 μm (k = 2) and 37 nm (k = 2), respectively.</description><subject>Confocal microscopy</subject><subject>depth measurement</subject><subject>diameter measurement</subject><subject>Interference</subject><subject>Interferometers</subject><subject>Optical fibers</subject><subject>Optical interferometry</subject><subject>Optical reflection</subject><subject>Optical variables measurement</subject><subject>Semiconductor device measurement</subject><subject>Semiconductor devices</subject><subject>Through-silicon vias</subject><issn>0733-8724</issn><issn>1558-2213</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2016</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNo9kE1PAjEQhhujiYjeTbw08bzYr_3oUUEUg-EAet2U7ixbAtu17R749xYhniaZPO87kwehe0pGlBL59DFfjRih2YhltBBUXqABTdMiYYzySzQgOedJkTNxjW683xJChSjyAQqLLhitdnhq1uCSF-WhwmPb1va4VG2FZ20AV4OzewjOaLw8-AB7XFuHP0H53pl2g0MDeAJdaP4iE6MiDA7bGq8aZ_tNg5dmZ7Rt8bdR_hZd1Wrn4e48h-hr-roavyfzxdts_DxPNJM0JFTonOtaaZIpDVoWKaeqqkShMpJV65QVmci5lIJmmYRarhllNK9YHg0QrTQfosdTb-fsTw8-lFvbuzaeLKOjIoKC8EiRE6Wd9d5BXXbO7JU7lJSUR7dldFse3ZZntzHycIoYAPjH81TGvwX_BdlOdSE</recordid><startdate>20161201</startdate><enddate>20161201</enddate><creator>Ahn, Heulbi</creator><creator>Park, Jungjae</creator><creator>Kim, Jong-Ahn</creator><creator>Jin, Jonghan</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. 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subjects | Confocal microscopy depth measurement diameter measurement Interference Interferometers Optical fibers Optical interferometry Optical reflection Optical variables measurement Semiconductor device measurement Semiconductor devices Through-silicon vias |
title | Optical Fiber-Based Confocal and Interferometric System for Measuring the Depth and Diameter of Through Silicon Vias |
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